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Yoshihisa Fujisaki, Yoshihisa Waser Fujisaki, Bonafos Caroline, Yoshihisa Fujisaki, Fujisaki Yoshihisa, Tingkai Li... - Materials and Physics for Nonvolatile Memories: Volume 1160

Yoshihisa Fujisaki, Yoshihisa Waser Fujisaki, Bonafos Caroline, Yoshihisa Fujisaki, Fujisaki Yoshihisa, Tingkai Li... Materials and Physics for Nonvolatile Memories: Volume 1160 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Martin Gall, Martin Grill Gall, Martin Gall, Gall Martin, Alfred Grill, Grill Alfred... - Materials, Processes and Reliability for Advanced Interconnects for

Martin Gall, Martin Grill Gall, Martin Gall, Gall Martin, Alfred Grill, Grill Alfred... Materials, Processes and Reliability for Advanced Interconnects for English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Alexander A. Demkov, Alexander A. (Freescale Semiconductor Inc. Demkov, Alexander A. (University of Texas Demkov, Butterbaugh Jeffery W., Alexander A. Demkov, Demkov Alexander A.... - Cmos Gate Stack Scaling Materials, Interfaces and Reliability

Alexander A. Demkov, Alexander A. (Freescale Semiconductor Inc. Demkov, Alexander A. (University of Texas Demkov, Butterbaugh Jeffery W., Alexander A. Demkov, Demkov Alexander A.... Cmos Gate Stack Scaling Materials, Interfaces and Reliability English 05.06.2014 Paperback / Softback Fr. 45.90 3-5 weeks

Norbert Koch, Norbert (Humboldt-Universitat Zu Berlin) Zoj Koch, Norbert Zojer Koch, Saw-Wai Hla, Hla Saw-Wai, Norbert Koch... - Concepts in Molecular and Organic Electronics: Volume 1154

Norbert Koch, Norbert (Humboldt-Universitat Zu Berlin) Zoj Koch, Norbert Zojer Koch, Saw-Wai Hla, Hla Saw-Wai, Norbert Koch... Concepts in Molecular and Organic Electronics: Volume 1154 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Vladimir Matias, Vladimir Huhne Matias, Robert Hammond, Ruben Huhne, Ruben Hühne, Vladimir Matias... - Artificially Induced Grain Alignment in Thin Films: Volume 1150

Vladimir Matias, Vladimir Huhne Matias, Robert Hammond, Ruben Huhne, Ruben Hühne, Vladimir Matias... Artificially Induced Grain Alignment in Thin Films: Volume 1150 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Ji Su, Ji Wang Su, Yasubumi Funruya, Funruya Yasubumi, Leng Jinsong, Ji Su... - Materials and Devices for Smart Systems Iii: Volume 1129

Ji Su, Ji Wang Su, Yasubumi Funruya, Funruya Yasubumi, Leng Jinsong, Ji Su... Materials and Devices for Smart Systems Iii: Volume 1129 English 05.06.2014 Paperback / Softback Fr. 45.90 3-5 weeks

M. Bewlay Palm, Martin Palm, Martin Bewlay Palm, Bernard P. Bewlay, Bewlay Bernard P., Yue-Hui He... - Advanced Intermetallic Based Alloys for Extreme Environment and

M. Bewlay Palm, Martin Palm, Martin Bewlay Palm, Bernard P. Bewlay, Bewlay Bernard P., Yue-Hui He... Advanced Intermetallic Based Alloys for Extreme Environment and English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Chu Chun Kimura Fu, Chun Chun Fu, Chun Chun Kimura Fu, Chun Chun Fu, Fu Chun Chun, Akihiko Kimura... - Materials for Future Fusion and Fission Technologies: Volume 1125

Chu Chun Kimura Fu, Chun Chun Fu, Chun Chun Kimura Fu, Chun Chun Fu, Fu Chun Chun, Akihiko Kimura... Materials for Future Fusion and Fission Technologies: Volume 1125 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Astrid Aksnes, Astrid (Norwegian University of Science an Aksnes, Astrid Amzajerdian Aksnes, Astrid Aksnes, Aksnes Astrid, Farzin Amzajerdian... - Materials and Devices for Laser Remote Sensing and Optical

Astrid Aksnes, Astrid (Norwegian University of Science an Aksnes, Astrid Amzajerdian Aksnes, Astrid Aksnes, Aksnes Astrid, Farzin Amzajerdian... Materials and Devices for Laser Remote Sensing and Optical English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Dirk Hong Wouters, Dirk J. Wouters, Dirk J. Hong Wouters, Orlando Auciello, Seungbum Hong, Hong Seungbum... - Materials Science and Technology for Nonvolatile Memories: Volume 1071

Dirk Hong Wouters, Dirk J. Wouters, Dirk J. Hong Wouters, Orlando Auciello, Seungbum Hong, Hong Seungbum... Materials Science and Technology for Nonvolatile Memories: Volume 1071 English 05.06.2014 Paperback / Softback Fr. 45.90 3-5 weeks

B. J. Pawlak, B. J. Pelaz Pawlak, M. Law, Law M., B. J. Pawlak, Pawlak B. J.... - Doping Engineering for Front-End Processing: Volume 1070

B. J. Pawlak, B. J. Pelaz Pawlak, M. Law, Law M., B. J. Pawlak, Pawlak B. J.... Doping Engineering for Front-End Processing: Volume 1070 English 05.06.2014 Paperback / Softback Fr. 45.90 3-5 weeks

Tingkai Li, Tingkai Redwing Li, Dadgar Armin, Tingkai Li, Li Tingkai, Michael Mastro... - Advances in Gan, Gaas, Sic and Related Alloys on Silicon Substrates:

Tingkai Li, Tingkai Redwing Li, Dadgar Armin, Tingkai Li, Li Tingkai, Michael Mastro... Advances in Gan, Gaas, Sic and Related Alloys on Silicon Substrates: English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Qinghuang Lin, Qinghuang Ryan Lin, Qinghuang Lin, Lin Qinghuang, E. Todd Ryan, Ryan E. Todd... - Materials, Processes, Integration Reliability in Advanced

Qinghuang Lin, Qinghuang Ryan Lin, Qinghuang Lin, Lin Qinghuang, E. Todd Ryan, Ryan E. Todd... Materials, Processes, Integration Reliability in Advanced English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Vivek Bharti, Vivek Bar-Cohen Bharti, Yoseph Bar-Cohen, Bar-Cohen Yoseph, Vivek Bharti, Bharti Vivek... - Electroresponsive Polymers and Their Applications: Volume 889

Vivek Bharti, Vivek Bar-Cohen Bharti, Yoseph Bar-Cohen, Bar-Cohen Yoseph, Vivek Bharti, Bharti Vivek... Electroresponsive Polymers and Their Applications: Volume 889 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Jeremy A. Theil, Jeremy A. Bohm Theil, Blalock Travis, Markus Bohm, Markus Böhm, Donald S. Gardner... - Materials, Integration and Technology for Monolithic Instruments:

Jeremy A. Theil, Jeremy A. Bohm Theil, Blalock Travis, Markus Bohm, Markus Böhm, Donald S. Gardner... Materials, Integration and Technology for Monolithic Instruments: English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Michael J. Mills, Michael J. (Ohio State University) Inui Mills, Michael J. Inui Mills, Helment Clemens, Fu Chong-Long, Haruyuki Inui... - Intergrative and Inerdisciplinary Aspects of Intermetallics: Volume 84

Michael J. Mills, Michael J. (Ohio State University) Inui Mills, Michael J. Inui Mills, Helment Clemens, Fu Chong-Long, Haruyuki Inui... Intergrative and Inerdisciplinary Aspects of Intermetallics: Volume 84 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Jung H. Shin, Jung H. Brongersma Shin, Mark Brongersma, Christoph Buchal, Buchal Christoph, Francesco Priolo... - New Materials for Microphotonics: Volume 817

Jung H. Shin, Jung H. Brongersma Shin, Mark Brongersma, Christoph Buchal, Buchal Christoph, Francesco Priolo... New Materials for Microphotonics: Volume 817 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

R. J. Carter, R. J. Hau-Riege Carter, R. J. Carter, Carter R. J., C. S. Hau-Riege, Hau-Riege C. S.... - Materials, Technology and Reliability for Advanced Interconnects and

R. J. Carter, R. J. Hau-Riege Carter, R. J. Carter, Carter R. J., C. S. Hau-Riege, Hau-Riege C. S.... Materials, Technology and Reliability for Advanced Interconnects and English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

Kenneth P. Rodbell, Kenneth P. (Ibm T J Watson Research Cente Rodbell, Kenneth P. Filter Rodbell, William F. Filter, Filter William F., Harold J. Frost... - Materials Reliability in Microelectronics Iii: Volume 309

Kenneth P. Rodbell, Kenneth P. (Ibm T J Watson Research Cente Rodbell, Kenneth P. Filter Rodbell, William F. Filter, Filter William F., Harold J. Frost... Materials Reliability in Microelectronics Iii: Volume 309 English 05.06.2014 Paperback / Softback Fr. 45.90 3-5 weeks

C. V. Thompson, C. V. (Massachusetts Institute of Techno Thompson, C. V. Lloyd Thompson, J. R. Lloyd, Lloyd J. R., C. V. Thompson... - Materials Reliability in Microelectronics Ii: Volume 265

C. V. Thompson, C. V. (Massachusetts Institute of Techno Thompson, C. V. Lloyd Thompson, J. R. Lloyd, Lloyd J. R., C. V. Thompson... Materials Reliability in Microelectronics Ii: Volume 265 English 05.06.2014 Paperback / Softback Fr. 47.90 3-5 weeks

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