Materials, Processes and Reliability for Advanced Interconnects for - Micro And Nanoelectronics 2009: Volume 115

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

List of contents

Part I. Low-k Dielectrics I; Part II. Low-k Dielectrics II; Part III. Poster Session: Interconnects; Part IV. Metalization I; Part V. Metallization II; Part VI. Reliability; Part VII. Emerging Interconnect Technologies; Part VIII. Joint Session: Interconnect and Packaging; Author index; Subject index.

Product details

• Authors: Martin Gall, Martin Grill Gall
• Assisted by: Martin Gall (Editor), Gall Martin (Editor), Alfred Grill (Editor), Grill Alfred (Editor), Koike Junichi (Editor), Francesca Lacopi (Editor), Lacopi Francesca (Editor), Usui Takamasa (Editor)
• Publisher: Cambridge University Press ELT
• Languages: English
• Product format: Paperback / Softback
• Released: 05.06.2014
• EAN: 9781107408319
• ISBN: 978-1-107-40831-9
• No. of pages: 204
• Series: MRS Proceedings; MRS Proceedings
• Subjects: Natural sciences, medicine, IT, technology > Technology > Miscellaneous; Materials science, TECHNOLOGY & ENGINEERING / Materials Science / General