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Liu, J. Liu, S. Liu, Shen Liu, Shen (Huazhong University of Science and Tech Liu, Shen (Huazhong University of Science and Technology Liu... - Led Packaging for Lighting Applications

Liu, J. Liu, S. Liu, Shen Liu, Shen (Huazhong University of Science and Tech Liu, Shen (Huazhong University of Science and Technology Liu... Led Packaging for Lighting Applications English 01.10.2011 Hardback Fr. 180.00 1-3 weeks (not available at short notice)

Claus M. Schneider, Klaus Wetzig, M Schneider, M Schneider, Claus M. Schneider, Klau Wetzig... - Metal Based Thin Films for Electronics

Claus M. Schneider, Klaus Wetzig, M Schneider, M Schneider, Claus M. Schneider, Klau Wetzig... Metal Based Thin Films for Electronics English, German 31.03.2015 Hardback Fr. 255.00 1-3 weeks (not available at short notice)

Richard Cameron, Richard J Cameron, Richard J. Cameron, Richard J. (Com Dev International) Kudsia Cameron, Richard J. Kudsia Cameron, Rj Cameron... - Microwave Filters for Communication Systems

Richard Cameron, Richard J Cameron, Richard J. Cameron, Richard J. (Com Dev International) Kudsia Cameron, Richard J. Kudsia Cameron, Rj Cameron... Microwave Filters for Communication Systems English 25.05.2018 Hardback Fr. 190.00 1-3 weeks (not available at short notice)

Stefano Grivet Talocia, Grivet-Talocia, S Grivet-Talocia, Stefan Grivet-Talocia, Stefano Grivet-Talocia, Stefano Gustavsen Grivet-Talocia... - Passive Macromodeling

Stefano Grivet Talocia, Grivet-Talocia, S Grivet-Talocia, Stefan Grivet-Talocia, Stefano Grivet-Talocia, Stefano Gustavsen Grivet-Talocia... Passive Macromodeling English 22.01.2016 Hardback Fr. 220.00 1-3 weeks (not available at short notice)

Shozo Nakamura, Shozo (Nakamura Technical Research Insti Nakamura, Nakamura Shozo - Polymeric Materials for Electronic Packaging

Shozo Nakamura, Shozo (Nakamura Technical Research Insti Nakamura, Nakamura Shozo Polymeric Materials for Electronic Packaging English 31.08.2023 Hardback Fr. 186.00 1-3 weeks (not available at short notice)

EP Li, Er-Ping Li, LI ER PING, Li Er-Ping - Electrical Modeling and Design for 3d System Integration

EP Li, Er-Ping Li, LI ER PING, Li Er-Ping Electrical Modeling and Design for 3d System Integration English 19.04.2012 Hardback Fr. 180.00 1-3 weeks (not available at short notice)

S W Rick Lee, S W Ricky Lee, S. W. Ricky Lee, S. W. Ricky Lo Lee, Swr Lee, Jeffery C Lo... - From Led to Solid State Lighting

S W Rick Lee, S W Ricky Lee, S. W. Ricky Lee, S. W. Ricky Lo Lee, Swr Lee, Jeffery C Lo... From Led to Solid State Lighting English 31.12.2018 Hardback Fr. 180.00 1-3 weeks (not available at short notice)

Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata, Toshiyuki Tsuchiya... Reliability of MEMS English, German 01.04.2013 Paperback / Softback Fr. 91.00 3-5 weeks

Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... CMOS-MEMS English 01.04.2013 Paperback / Softback Fr. 91.00 3-5 weeks

Jasbir Bath, Jasbir (EDT)/ Henshall Bath, Jasbir Handwerker Bath, Carol A. Handwerker, G Henshall, Greg Henshall... - Lead-Free Solder Process Development

Jasbir Bath, Jasbir (EDT)/ Henshall Bath, Jasbir Handwerker Bath, Carol A. Handwerker, G Henshall, Greg Henshall... Lead-Free Solder Process Development English 01.03.2011 Hardback Fr. 176.00 1-3 weeks (not available at short notice)

Liu, J Liu, J. Liu, S Liu, S. Liu, Shen (Huazhong University of Science and Tech Liu... - Modeling and Simulation for Microelectronic Packaging Assembly

Liu, J Liu, J. Liu, S Liu, S. Liu, Shen (Huazhong University of Science and Tech Liu... Modeling and Simulation for Microelectronic Packaging Assembly English 21.10.2011 Hardback Fr. 180.00 1-3 weeks (not available at short notice)

Rainer Waser, Raine Waser, Rainer Waser - Nanoelectronics and Information Technology

Rainer Waser, Raine Waser, Rainer Waser Nanoelectronics and Information Technology English, German 01.04.2012 Hardback Fr. 128.00 3-5 weeks

Jaroszewski, M Jaroszewski, Macie Jaroszewski, Maciej Jaroszewski, Maciej Thomas Jaroszewski, Ajay V Rane... - Advanced Materials for Electromagnetic Shielding

Jaroszewski, M Jaroszewski, Macie Jaroszewski, Maciej Jaroszewski, Maciej Thomas Jaroszewski, Ajay V Rane... Advanced Materials for Electromagnetic Shielding English 01.01.2019 Hardback Fr. 296.00 1-3 weeks (not available at short notice)

S Kyeong, San Kyeong, San (University of Maryland Kyeong, San Pecht Kyeong, Michael G. Pecht, Seoul Na... - Electrical Connectors

S Kyeong, San Kyeong, San (University of Maryland Kyeong, San Pecht Kyeong, Michael G. Pecht, Seoul Na... Electrical Connectors English 31.10.2020 Hardback Fr. 190.00 1-3 weeks (not available at short notice)

Shen Liu, Sheng Liu, Liu Shen, Xiaobing Luo, Xiaobing et al Luo, K Wang... - Freeform Optics for Led Packages and Applications

Shen Liu, Sheng Liu, Liu Shen, Xiaobing Luo, Xiaobing et al Luo, K Wang... Freeform Optics for Led Packages and Applications English 05.07.2017 Hardback Fr. 200.00 3-5 weeks

Flora Li, Flora M Li, Flora M. Li, Aroki Nathan, Arokia Nathan, Beng S. Ong... - Organic Thin Film Transistor Integration

Flora Li, Flora M Li, Flora M. Li, Aroki Nathan, Arokia Nathan, Beng S. Ong... Organic Thin Film Transistor Integration English, German 12.04.2011 Hardback Fr. 134.00 3-5 weeks

Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang - Sip System-In-Package Design and Simulation

Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang Sip System-In-Package Design and Simulation English 11.09.2017 Hardback Fr. 200.00 1-3 weeks (not available at short notice)

Jasbir Bath, Handwerker, Carol Handwerker, Carol A Handwerker, Carol A. Handwerker, Kato... - Mitigating Tin Whisker Risks

Jasbir Bath, Handwerker, Carol Handwerker, Carol A Handwerker, Carol A. Handwerker, Kato... Mitigating Tin Whisker Risks English 01.07.2016 Hardback Fr. 186.00 1-3 weeks (not available at short notice)

Beth Krohnert Keser, Beth Keser, Steffen Kr¿hnert, Kröhnert, Steffen Kröhnert - Embedded Fan Out Wafer Panel Level Packaging Technologies for

Beth Krohnert Keser, Beth Keser, Steffen Kr¿hnert, Kröhnert, Steffen Kröhnert Embedded Fan Out Wafer Panel Level Packaging Technologies for English 04.01.2022 Hardback Fr. 196.00 1-3 weeks (not available at short notice)

Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... Advanced Micro and Nano Systems. Vol.1 English 01.01.2004 Hardback Fr. 317.00 1-3 weeks (not available at short notice)

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