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Modeling and Simulation for Microelectronic Packaging Assembly
English
21.10.2011
Hardback
Fr. 180.00
Embedded Fan Out Wafer Panel Level Packaging Technologies for
English
04.01.2022
Hardback
Fr. 196.00
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
English
31.01.2019
Hardback
Fr. 190.00