Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing

Informationen zum Autor Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Yong Liu is a global team leader of electrical, thermal-mechanical modeling and analysis at Fairchild Semiconductor Corp in South Portland, Maine. His main interest areas are IC packaging, modeling and simulation, reliability and material characterization. He has previously served as Professor at Zhejiang University of Technology, and has worked as an opto package engineer at Nortel Networks in Boston. Liu has co-authored over 100 papers in journals and conferences, has filed over 40 US patents in the area of IC packaging and power device, and has won numerous awards and fellowships in academia and industry: the Fairchild President Award, Fairchild Key Technologist, Fairchild New Product Innovation Award, the Alexander von Humboldt European Fellowship for study at Braunschweig University of Technology and University of Cambridge. Liu holds a PhD from Nanjing University of Science and Technology. Klappentext Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.   Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging Zusammenfassung An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This ...

List of contents

Foreword by C. P. Wong xiii
 
Foreword by Zhigang Suo xv
 
Preface xvii
 
Acknowledgments xix
 
About the Authors xxi
 
Part I Mechanics and Modeling 1
 
1 Constitutive Models and Finite Element Method 3
 
1.1 Constitutive Models for Typical Materials 3
 
1.2 Finite Element Method 9
 
1.3 Chapter Summary 18
 
References 19
 
2 Material and Structural Testing for Small Samples 21
 
2.1 Material Testing for Solder Joints 21
 
2.2 Scale Effect of Packaging Materials 32
 
2.3 Two-Ball Joint Specimen Fatigue Testing 41
 
2.4 Chapter Summary 41
 
References 43
 
3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 45
 
3.1 Constitutive Model for Tin-Lead Solder Joint 45
 
3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills 50
 
3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys 56
 
3.4 User-Supplied Subroutines for Solders Considering Damage Evolution 67
 
3.5 Chapter Summary 76
 
References 76
 
4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages 79
 
4.1 Life Prediction Methodology 79
 
4.2 Accelerated Testing Methodology 82
 
4.3 Constitutive Modeling Methodology 83
 
4.4 Solder Joint Reliability via FEA 84
 
4.5 Life Prediction of Flip-Chip Packages 93
 
4.6 Chapter Summary 99
 
References 99
 
5 Multi-Physics and Multi-Scale Modeling 103
 
5.1 Multi-Physics Modeling 103
 
5.2 Multi-Scale Modeling 106
 
5.3 Chapter Summary 107
 
References 108
 
6 Modeling Validation Tools 109
 
6.1 Structural Mechanics Analysis 109
 
6.2 Requirements of Experimental Methods for Structural Mechanics Analysis 111
 
6.3 Whole Field Optical Techniques 112
 
6.4 Thermal Strains Measurements Using Moire Interferometry 113
 
6.5 In-Situ Measurements on Micro-Machined Sensors 116
 
6.6 Real-Time Measurements Using Speckle Interferometry 119
 
6.7 Image Processing and Computer Aided Optical Techniques 120
 
6.8 Real-Time Thermal-Mechanical Loading Tools 123
 
6.9 Warpage Measurement Using PM-SM System 124
 
6.10 Chapter Summary 131
 
References 131
 
7 Application of Fracture Mechanics 135
 
7.1 Fundamental of Fracture Mechanics 135
 
7.2 Bulk Material Cracks in Electronic Packages 141
 
7.3 Interfacial Fracture Toughness 148
 
7.4 Three-Dimensional Energy Release Rate Calculation 159
 
7.5 Chapter Summary 165
 
References 165
 
8 Concurrent Engineering for Microelectronics 169
 
8.1 Design Optimization 169
 
8.2 New Developments and Trends in Integrated Design Tools 179
 
8.3 Chapter Summary 183
 
References 183
 
Part II Modeling in Microelectronic Packaging and Assembly 185
 
9 Typical IC Packaging and Assembly Processes 187
 
9.1 Wafer Process and Thinning 188
 
9.2 Die Pick Up 193
 
9.3 Die Attach 198
 
9.4 Wire Bonding 206
 
9.5 Molding 223
 
9.6 Leadframe Forming/Singulation 241
 
9.7 Chapter Summary 252
 
References 252
 
10 Opto Packaging and Assembly 255
 
10.1 Silicon Substrate Based Opto Package Assembly 255
 
10.2 Welding of a Pump Laser Module 258
 
10.3 Chapter Summary 264
 
References 264
 
11 MEMS and MEMS Package Assembly 267
 
11.1 A Pressure Sensor Packaging (Deformation and Stress) 2

Product details

• Authors: Liu, J Liu, J. Liu, S Liu, S. Liu, Shen (Huazhong University of Science and Tech Liu, Sheng Liu, Sheng Liu Liu, Yong Liu, Liu Shen
• Publisher: Wiley, John and Sons Ltd
• Languages: English
• Product format: Hardback
• Released: 21.10.2011
• EAN: 9780470827802
• ISBN: 978-0-470-82780-2
• No. of pages: 576
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; Elektronikbauteile, Electrical & Electronics Engineering, Elektrotechnik u. Elektronik, Electronic Packaging, Production and industrial engineering, Elektronische Baugruppe