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Emma Bender, Emmanuel Bender, Alain Bensoussan, Alain (Universite Paris-Dauphine et INRIA) Bensoussan, Bensoussan Alain, Joseph B Bernstein... - Reliability Prediction for Microelectronics
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Haifei Bao, Bao Haifei, Jingdong Chen, Liguo Chen, Chen Jingdong, Chen Liguo... - Measurement Technology for Micro-Nanometer Devices
Haifei Bao, Bao Haifei, Jingdong Chen, Liguo Chen, Chen Jingdong, Chen Liguo... Measurement Technology for Micro-Nanometer Devices Inglese 21.11.2016 Copertina rigida Fr. 206.00 1-3 settimane (non disponibile a breve termine)
Franco Maloberti, Maloberti Franco - Understanding Microelectronics
Franco Maloberti, Maloberti Franco Understanding Microelectronics Inglese 01.12.2011 Copertina rigida Fr. 100.00 3-5 settimane
Tanweer Ahsan, Ahsan Tanweer, K Mittal, K L Mittal, K. L Ahsan Mittal, K. L. Mittal... - Adhesion in Microelectronics
Tanweer Ahsan, Ahsan Tanweer, K Mittal, K L Mittal, K. L Ahsan Mittal, K. L. Mittal... Adhesion in Microelectronics Inglese 24.10.2014 Copertina rigida Fr. 275.00 1-3 settimane (non disponibile a breve termine)
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... - CMOS-MEMS
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... CMOS-MEMS Inglese 01.04.2013 Tascabile Fr. 91.00 3-5 settimane
Christopher Bower, Philip Garrou, Peter Ramm, Christophe Bower, Christopher Bower, Philip Garrou... - Handbook of 3D Integration. Vol.1/2
Christopher Bower, Philip Garrou, Peter Ramm, Christophe Bower, Christopher Bower, Philip Garrou... Handbook of 3D Integration. Vol.1/2 Inglese, Tedesco 01.09.2012 Tascabile Fr. 169.00 3-5 settimane
Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang - Sip System-In-Package Design and Simulation
Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang Sip System-In-Package Design and Simulation Inglese 11.09.2017 Copertina rigida Fr. 200.00 1-3 settimane (non disponibile a breve termine)
Andreas Schenk - Advanced Physical Models for Silicon Device Simulation
Andreas Schenk Advanced Physical Models for Silicon Device Simulation Inglese 12.03.2013 Tascabile Fr. 188.00 1-2 settimane (il titolo viene stampato sull'ordine)
Nader Jalili - Piezoelectric-Based Vibration Control
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Peter-Klaus Budig - Langenscheidt Fachwörterbuch Kompakt Elektrotechnik und Elektronik Englisch
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Andreas Greiner, Jan Korvink, Jan G Korvink, Jan G. Korvink - Semiconductors for Micro- and Nanotechnology
Andreas Greiner, Jan Korvink, Jan G Korvink, Jan G. Korvink Semiconductors for Micro- and Nanotechnology Inglese, Tedesco 01.01.2002 Copertina rigida Fr. 123.00 1-3 settimane (non disponibile a breve termine)
K. J. Bachmann, Kj Bachmann, Klaus J. Bachmann, BACHMANN KLAUS J, Bachmann Klaus J. - Materials Science of Microelectronics
K. J. Bachmann, Kj Bachmann, Klaus J. Bachmann, BACHMANN KLAUS J, Bachmann Klaus J. Materials Science of Microelectronics Inglese 30.12.1994 Copertina rigida Fr. 336.00 1-3 settimane (non disponibile a breve termine)
Schaper, Leonard W. Schaper, Ulrich, R.k. Schaper Ulrich, Richard K. Ulrich, Richard K. (University of Arkansas At Faye Ulrich... - Integrated Passive Component Technology
Schaper, Leonard W. Schaper, Ulrich, R.k. Schaper Ulrich, Richard K. Ulrich, Richard K. (University of Arkansas At Faye Ulrich... Integrated Passive Component Technology Inglese 11.07.2003 Copertina rigida Fr. 230.00 1-3 settimane (non disponibile a breve termine)
Jiang, Xiaonin Jiang, Xiaoning Jiang, Jiang Xiaoning, Varadan, V V Varadan... - Microstereolithography and Other Fabrication Techniques for 3d Mems
Jiang, Xiaonin Jiang, Xiaoning Jiang, Jiang Xiaoning, Varadan, V V Varadan... Microstereolithography and Other Fabrication Techniques for 3d Mems Inglese 29.01.2001 Copertina rigida Fr. 330.00 1-3 settimane (non disponibile a breve termine)
Gupta, Tapan Gupta, Tapan K Gupta, Tapan K. Gupta, Tapan K. (Rmd Gupta, Tappan K. Gupta... - Handbook of Thick- And Thin-Film Hybrid Microelectronics
Gupta, Tapan Gupta, Tapan K Gupta, Tapan K. Gupta, Tapan K. (Rmd Gupta, Tappan K. Gupta... Handbook of Thick- And Thin-Film Hybrid Microelectronics Inglese 13.05.2003 Copertina rigida Fr. 246.00 1-3 settimane (non disponibile a breve termine)
Brown, William D. Brown, William D. (University of Arkansas) Ulrich Brown, Richard K. Ulrich, Richard K. (University of Arkansas) Brown Ulrich, Richard K. Brown Ulrich... - Advanced Electronic Packaging
Brown, William D. Brown, William D. (University of Arkansas) Ulrich Brown, Richard K. Ulrich, Richard K. (University of Arkansas) Brown Ulrich, Richard K. Brown Ulrich... Advanced Electronic Packaging Inglese 23.05.2006 Copertina rigida Fr. 265.00 1-3 settimane (non disponibile a breve termine)
Serg Luryi, Serge Luryi, Serge Xu Luryi, LURYI SERGE XU JIMMY ZASLAVSKY, Jimm Xu, Jimmy Xu... - Future Trends in Microelectronics
Serg Luryi, Serge Luryi, Serge Xu Luryi, LURYI SERGE XU JIMMY ZASLAVSKY, Jimm Xu, Jimmy Xu... Future Trends in Microelectronics Inglese 08.06.2007 Copertina rigida Fr. 169.00 1-3 settimane (non disponibile a breve termine)
Y Li, Yuzhuo Li, Li Yuzhuo, Yuzhu Li, Yuzhuo Li, Li Yuzhuo - Microelectronic Applications of Chemical Mechanical Planarization
Y Li, Yuzhuo Li, Li Yuzhuo, Yuzhu Li, Yuzhuo Li, Li Yuzhuo Microelectronic Applications of Chemical Mechanical Planarization Inglese 13.11.2007 Copertina rigida Fr. 280.00 1-3 settimane (non disponibile a breve termine)
Mikhail Baklanov, Mikhail (Imec Baklanov, Mikhail Maex Baklanov, Mikhail R. Maex Baklanov, Mr Baklanov, BAKLANOV MIKHAIL MAEX KAREN GREE... - Dielectric Films for Advanced Microelectronics
Mikhail Baklanov, Mikhail (Imec Baklanov, Mikhail Maex Baklanov, Mikhail R. Maex Baklanov, Mr Baklanov, BAKLANOV MIKHAIL MAEX KAREN GREE... Dielectric Films for Advanced Microelectronics Inglese 09.02.2007 Copertina rigida Fr. 346.00 1-3 settimane (non disponibile a breve termine)
G. Fishbine, Glenn Fishbine, Glenn (Lake Region Manufacturing Fishbine - Investor''s Guide to Nanotechnology & Micromachines
G. Fishbine, Glenn Fishbine, Glenn (Lake Region Manufacturing Fishbine Investor''s Guide to Nanotechnology & Micromachines Inglese 04.02.2002 Copertina rigida Fr. 82.00 1-3 settimane (non disponibile a breve termine)