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Informationen zum Autor TAPAN K. GUPTA, PhD, received an MA in Physics from Indian Institute of Technology, a PhD in Physics from Boston College, and was a Post Doctoral Fellow in the Electrical Engineering and Communication Department at Lehigh University. A former Analog Devices Career Development professor in the Electrical Engineering Department at Tufts University, Dr. Gupta is currently a senior research scientist in the advanced materials group at Radiation Monitoring Devices, MA. He is also responsible for the synthesis and characterization of new materials and their applications in nuclear medicine at the Massachusetts Institute of Technology, Cambridge, MA. Dr. Gupta has authored a book chapter on solar cells and materials for Allied Publications, New Delhi, and more than forty-five peer-reviewed articles in the field of physics, material science, and semiconductor physics. Klappentext This is the first handbook on the fabrication and design of hybrid microelectronic circuits.* Deals with all aspects of the technology, design, layout and processing of materials.* Fills the need for a comprehensive survey of a widely-used technology. Zusammenfassung Virtually all sectors of the electrical and electronics industries use solid state systems which utilize thick and thin film hybrid microcircuitry. This book offers a study of hybrid microelectronic circuits which examines both thick and thin film technologies, including semiconductor device technology. Inhaltsverzeichnis Preface. 1- Introduction. 2- Mathematical Foundations Circuit Design, and Layout Rules for Hybrid Microcircuits. 3- Computer-Aided Design and Pattern Generation Techniques. 4- Thick-Film Fundamentals. 5- Thick-Film Deposition Techniques. 6- Thin-Film Fundamentals. 7- Thin-Film Deposition Techniques. 8- Component Assembly and Interconnections. 9- Adjustment of Passive Components. 10- Packaging and Thermal Considerations. 11- Multichip Module and Microwave Hybrids Circuits. Glossary. Index. ...
Sommario
Preface.
1- Introduction.
2- Mathematical Foundations Circuit Design, and Layout Rules for Hybrid Microcircuits.
3- Computer-Aided Design and Pattern Generation Techniques.
4- Thick-Film Fundamentals.
5- Thick-Film Deposition Techniques.
6- Thin-Film Fundamentals.
7- Thin-Film Deposition Techniques.
8- Component Assembly and Interconnections.
9- Adjustment of Passive Components.
10- Packaging and Thermal Considerations.
11- Multichip Module and Microwave Hybrids Circuits.
Glossary.
Index.
Relazione
"...this handbook provides standard reference material for the hybrid microelectronics area, with a level of detail consistent with a handbook." ( MRS Bulletin , April 2005)
"This book gives thorough coverage of these subjects; the descriptions are up to date, and cover the fundamentals, so the book should be useful for some time to come." ( IEEE Electrical Insulation Magazine , November/December 2004)
