Fr. 228.00

Ambient Intelligence with Microsystems - Building Ambient Intelligence Through Microsystems Technology

Anglais · Livre Relié

Expédition généralement dans un délai de 3 à 5 semaines (titre commandé spécialement)

Description

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Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept.
Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user.
Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.

Table des matières

The Concepts.- An Overview of Pervasive Computing Systems.- Augmenting Materials to Build Cooperating Objects.- Device Technologies.- Overview of Component Level Devices.- Silicon Technologies for Microsystems, Microsensors and Nanoscale Devices.- Hardware Sub-Systems Technologies.- Distributed, Embedded Sensor and Actuator Platforms.- Embedded Microelectronic Subsystems.- Networking Technologies.- Embedded Wireless Networking: Principles, Protocols, and Standards.- Systems Technologies.- Context in Pervasive Environments.- Achieving Co-Operation and Developing Smart Behavior in Collections of Context-Aware Artifacts.- System-Level Challenges.- Power Management, Energy Conversion and Energy Scavenging for Smart Systems.- Challenges for Hardware Reliability in Networked Embedded Systems.- System Co-Design.- Co-Design: From Electronic Substrates to Smart Objects.- Co-Design for Context Awareness in Pervasive Systems.- User-Centered Systems.- User-Centred Design and Development of Future Smart Systems: Opportunities and Challenges.- Embedded Systems Research and Innovation Programmes for Industry.- Applied Systems.- Sensor Architectures for Interactive Environments.- Building Networkable Smart and Cooperating Objects.- Dedicated Networking Solutions for a Container Tracking System.

Résumé

This investigation of current approaches to developing networkable smart objects for ambient intelligence emphasizes the microsystems and nanoscale devices required to achieve effective smart systems. It reviews the current ongoing research on effectively embedding computing technology into the everyday objects and investigates the form that these microscale and hybrid systems technologies must take for these programs to be successfully realized. The book examines the issues required to ensure that hardware technologies become capable of being seamlessly integrated into everyday objects. This includes studies on the requirements for integrated computation with MEMs sensors and the role of electronics packaging technology platforms, such as system-in-a-package and multi-chip modules, in implementing new, fully embedded, internet-like heterogeneous systems. It also discusses current progress and future directions in realizing applications-oriented smart objects.

Détails du produit

Collaboration Kiera Delaney (Editeur), Kieran Delaney (Editeur)
Edition Springer, Berlin
 
Langues Anglais
Format d'édition Livre Relié
Sortie 14.11.2008
 
EAN 9780387462639
ISBN 978-0-387-46263-9
Pages 422
Poids 768 g
Illustrations XIV, 422 p.
Thèmes Microsystems
MEMS Reference Shelf
Microsystems and Nanosystems
Microsystems and Nanosystems
MEMS Reference Shelf
Microsystems
Catégorie Sciences naturelles, médecine, informatique, technique > Informatique, ordinateurs > Informatique

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