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A brief history review of how dicing microelectronic substrates started. The book covers both the dicing machines used, the blades used for the many different applications and the application side.
A propos de l'auteur
Gideon Levinson was the dicing blades R&D developer manager for Kulick & Soffa (K&S). The development took place in the US and then the project was transferred to K&S in Israel. Gideon was managing many new blade development technologies for new market demands. Gideon was for many years the product manager for the dicing blade lines aiming continuously to meet new market demands. He has vast experience in the marketplace, providing technical seminars worldwide. Gideon Has been granted for a few patents related to special blade geometries in the dicing blade manufacturing process and wrote technical articles on dicing which were published in leading Micro Electronic Magazines. He was also the Senior Product Specialist Manager for North America for 4 years handling many new market R&D projects. This activity resulted in high volume production lines involving many dicing saws. He later became the application center development manager for the dicing division in Kulick and Soffa Israel and later in Advanced Dicing Technologies (ADT). Gideon is a Practical Mechanical Engineer with vast experience in precision grinding which was his basic background prior getting into the dicing business. Among his past achievements are precision manufacturing of linear slides, small bonding tools used in the microelectronic industry and leading the manufacturing processes design of complicated accurate mechanical manufacturing parts. On a privet level, Gideon main hobby for many years is woodworking in his machine shop where he makes wooden gear clocks, toys for his 7 grand kids and many other woodworking projects.
