Thermoelectrical Effect in SiC for High-Temperature MEMS Sensors

This book presents the fundamentals of the thermoelectrical effect in silicon carbide (SiC), including the thermoresistive, thermoelectric, thermocapacitive and thermoelectronic effects. It summarizes the growth of SiC, its properties and fabrication processes for SiC devices and introduces the thermoelectrical sensing theories in different SiC morphologies and polytypes. Further, it reviews the recent advances in the characterization of the thermoelectrical effect in SiC at high temperatures. Discussing several desirable features of thermoelectrical SiC sensors and recent developments in these sensors, the book provides useful guidance on developing high sensitivity and linearity, fast-response SiC sensing devices based on thermoelectrical effects.

Table des matières

Introduction to SiC and Thermoelectrical Properties.- Fundamentals of Thermoelectrical Effect in SiC.- Desirable Features for High Temperature SiC Sensors.- Fabrication of SiC MEMS Sensors.- Impact of Design and Process on Performance of SiC Thermal Devices.- Applications of Thermoelectrical Effect in SiC.- Future prospects of SiC Thermoelectrical Sensing Devices.

Résumé

This book presents the fundamentals of the thermoelectrical effect in silicon carbide (SiC), including the thermoresistive, thermoelectric, thermocapacitive and thermoelectronic effects. It summarizes the growth of SiC, its properties and fabrication processes for SiC devices and introduces the thermoelectrical sensing theories in different SiC morphologies and polytypes. Further, it reviews the recent advances in the characterization of the thermoelectrical effect in SiC at high temperatures. Discussing several desirable features of thermoelectrical SiC sensors and recent developments in these sensors, the book provides useful guidance on developing high sensitivity and linearity, fast-response SiC sensing devices based on thermoelectrical effects.

Détails du produit

• Auteurs: Dzung Viet Dao, Toa Dinh, Toan Dinh, Nam-Trun Nguyen, Nam-Trung Nguyen
• Edition: Springer, Berlin
• Langues: Anglais
• Format d'édition: Livre de poche
• Sortie: 30.11.2018
• EAN: 9789811325700
• ISBN: 978-981-1325-70-0
• Pages: 115
• Dimensions: 159 mm x 4 mm x 233 mm
• Poids: 207 g
• Illustrations: XI, 115 p. 66 illus., 60 illus. in color.
• Thèmes: SpringerBriefs in Applied Sciences and Technology; SpringerBriefs in Applied Sciences and Technology
• Catégories: Sciences naturelles, médecine, informatique, technique > Technique > Autres; C, Chemistry and Materials Science, Solid State Physics, Other manufacturing technologies, Condensed matter, Nanotechnology, Electronic Devices, Spectrum analysis, spectrochemistry, mass spectrometry, Microsystems and MEMS, Nanotechnology and Microengineering, Electronics engineering