Fr. 236.00

Analog Circuit Design - Mixed A/D Circuit Design, Sensor Interface Circuits and Communication Circuits

Anglais · Livre de poche

Expédition généralement dans un délai de 1 à 2 semaines (titre imprimé sur commande)

Description

En savoir plus

Some examples have been presented of BiCMOS circuit design in mixed signal ASICs. It is by no means an exhaustive list. Many cells have not been mentioned, including 300MHz CMOS Video DACs, 20 Bit Sigma-Delta ADCs, Real-time and Switched-Cap Filters, Line Drivers and Receivers and many more. References. [1] J.Corcoran "High Speed Sample and Hold and Analog-to-Digital Converter Circuits",Advances in Analog Circuit Design, April1992. [2] Y.S.Yee,L.M.Terman and L.G.Heller "A lmV MOS comparator," IEEE J. of Solid-State Circuits, vol. SC-13, June 1978. [3] M.Timko and P.Holloway "Circuit Techniques for Achieving High Speed High Resolution AID Conversion" IEEE Journal of Solid-State Circuits, vol. SC-15, No.6, December 1980. [4] W.H. Gross "New High Speed Amplifier Design, Design Techniques and Layout Problems", Advances in Analog Circuit Design, April 1992. MIXED SIGNAL ASIC DESIGN FOR AUTOMOTIVE AND INDUSTRIAL APPLICATIONS H. Casicr Mietcc Alcatel, Brussels, Belgium ABSTRACT This paper describes the special aspects of mixed signal design in the ASIC environment. The knowledge of the application specific environment and of the function of the ASIC can be used advantageously to lower the cost and to enhance the performance at all levels of design. Several examples of this cost improvement and performance enhancement at device, circuit and system level are shown.

Table des matières

I: Mixed Analogue-Digital Circuit Design.- Groundbounce in CMOS.- Design Aspects for Mixed Analog-Digital Circuits.- Design Aspects Using ELDO.- Simulation of a Floppy Disk Drive Head Position Controller.- Mixed Signal ASIC Design.- Mixed Signal ASIC Design for Automotive and Industrial Applications.- II Sensor Interface Circuits.- Sensor Signal Normalization.- Analog Data Acquisition Circuits in Integrated Sensing Systems.- Integrated Interface Circuits for Capacitive Micromechanical Sensors.- Interfaces for Microsensor Systems.- Sensor Interface Systems.- Indirect Converters and Oversampling for Application in Monolithic Smart Sensors.- III: Communication Circuits.- The Challenges for Analog Circuit Design in Mobile Radio VLSI Chips.- A View of Gallium Arsenide I.C.'s in Wireless Communication Systems.- Design Techniques for 1GHz Downconversion ICs Fabricated in a 1?m 13GHz BiCMOS Process.- New RF Devices Based on High Precision CMOS Time-to-Digital and Digital-to-Time Converters.- A Fully Integrated 1 V/ 100?A high Bitrate CP-FSK receiver.- DECT Zero IF Receiver Front End.

Détails du produit

Collaboration Rudy J. van de Plassche (Editeur), Joha Huijsing (Editeur), Johan Huijsing (Editeur), Johan H. Huijsing (Editeur), Rudy J van de Plassche (Editeur), Rudy J. Van De Plassche (Editeur), Willy Sansen (Editeur), Willy M. C. Sansen (Editeur), Willy M.C. Sansen (Editeur), Rudy J. van de Plassche (Editeur)
Edition Springer, Berlin
 
Langues Anglais
Format d'édition Livre de poche
Sortie 22.10.2010
 
EAN 9781441951380
ISBN 978-1-4419-5138-0
Pages 318
Dimensions 155 mm x 18 mm x 235 mm
Poids 505 g
Illustrations VIII, 318 p.
Catégorie Sciences naturelles, médecine, informatique, technique > Technique > Electronique, électrotechnique, technique de l'information

Commentaires des clients

Aucune analyse n'a été rédigée sur cet article pour le moment. Sois le premier à donner ton avis et aide les autres utilisateurs à prendre leur décision d'achat.

Écris un commentaire

Super ou nul ? Donne ton propre avis.

Pour les messages à CeDe.ch, veuillez utiliser le formulaire de contact.

Il faut impérativement remplir les champs de saisie marqués d'une *.

En soumettant ce formulaire, tu acceptes notre déclaration de protection des données.