Langues
Catégorie
Format
disponibilité
Auteurs

Résultat de la recherche

M. Bewlay Palm, Martin Palm, Martin Bewlay Palm, Bernard P. Bewlay, Bewlay Bernard P., Yue-Hui He... - Advanced Intermetallic Based Alloys for Extreme Environment and
M. Bewlay Palm, Martin Palm, Martin Bewlay Palm, Bernard P. Bewlay, Bewlay Bernard P., Yue-Hui He... Advanced Intermetallic Based Alloys for Extreme Environment and Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Chu Chun Kimura Fu, Chun Chun Fu, Chun Chun Kimura Fu, Chun Chun Fu, Fu Chun Chun, Akihiko Kimura... - Materials for Future Fusion and Fission Technologies: Volume 1125
Chu Chun Kimura Fu, Chun Chun Fu, Chun Chun Kimura Fu, Chun Chun Fu, Fu Chun Chun, Akihiko Kimura... Materials for Future Fusion and Fission Technologies: Volume 1125 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Astrid Aksnes, Astrid (Norwegian University of Science an Aksnes, Astrid Amzajerdian Aksnes, Astrid Aksnes, Aksnes Astrid, Farzin Amzajerdian... - Materials and Devices for Laser Remote Sensing and Optical
Astrid Aksnes, Astrid (Norwegian University of Science an Aksnes, Astrid Amzajerdian Aksnes, Astrid Aksnes, Aksnes Astrid, Farzin Amzajerdian... Materials and Devices for Laser Remote Sensing and Optical Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
B. J. Pawlak, B. J. Pelaz Pawlak, M. Law, Law M., B. J. Pawlak, Pawlak B. J.... - Doping Engineering for Front-End Processing: Volume 1070
B. J. Pawlak, B. J. Pelaz Pawlak, M. Law, Law M., B. J. Pawlak, Pawlak B. J.... Doping Engineering for Front-End Processing: Volume 1070 Anglais 05.06.2014 Livre de poche Fr. 45.90 3-5 semaines
Tingkai Li, Tingkai Redwing Li, Dadgar Armin, Tingkai Li, Li Tingkai, Michael Mastro... - Advances in Gan, Gaas, Sic and Related Alloys on Silicon Substrates:
Tingkai Li, Tingkai Redwing Li, Dadgar Armin, Tingkai Li, Li Tingkai, Michael Mastro... Advances in Gan, Gaas, Sic and Related Alloys on Silicon Substrates: Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Qinghuang Lin, Qinghuang Ryan Lin, Qinghuang Lin, Lin Qinghuang, E. Todd Ryan, Ryan E. Todd... - Materials, Processes, Integration Reliability in Advanced
Qinghuang Lin, Qinghuang Ryan Lin, Qinghuang Lin, Lin Qinghuang, E. Todd Ryan, Ryan E. Todd... Materials, Processes, Integration Reliability in Advanced Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Jeremy A. Theil, Jeremy A. Bohm Theil, Blalock Travis, Markus Bohm, Markus Böhm, Donald S. Gardner... - Materials, Integration and Technology for Monolithic Instruments:
Jeremy A. Theil, Jeremy A. Bohm Theil, Blalock Travis, Markus Bohm, Markus Böhm, Donald S. Gardner... Materials, Integration and Technology for Monolithic Instruments: Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Jung H. Shin, Jung H. Brongersma Shin, Mark Brongersma, Christoph Buchal, Buchal Christoph, Francesco Priolo... - New Materials for Microphotonics: Volume 817
Jung H. Shin, Jung H. Brongersma Shin, Mark Brongersma, Christoph Buchal, Buchal Christoph, Francesco Priolo... New Materials for Microphotonics: Volume 817 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
R. J. Carter, R. J. Hau-Riege Carter, R. J. Carter, Carter R. J., C. S. Hau-Riege, Hau-Riege C. S.... - Materials, Technology and Reliability for Advanced Interconnects and
R. J. Carter, R. J. Hau-Riege Carter, R. J. Carter, Carter R. J., C. S. Hau-Riege, Hau-Riege C. S.... Materials, Technology and Reliability for Advanced Interconnects and Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
C. V. Thompson, C. V. (Massachusetts Institute of Techno Thompson, C. V. Lloyd Thompson, J. R. Lloyd, Lloyd J. R., C. V. Thompson... - Materials Reliability in Microelectronics Ii: Volume 265
C. V. Thompson, C. V. (Massachusetts Institute of Techno Thompson, C. V. Lloyd Thompson, J. R. Lloyd, Lloyd J. R., C. V. Thompson... Materials Reliability in Microelectronics Ii: Volume 265 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
D. T. Grubb, D. T. Mita Grubb, David T. Mita Grubb, D. T. Grubb, Grubb D. T., Itaru Mita... - Materials Science of High Temperature Polymers for Microelectronics:
D. T. Grubb, D. T. Mita Grubb, David T. Mita Grubb, D. T. Grubb, Grubb D. T., Itaru Mita... Materials Science of High Temperature Polymers for Microelectronics: Anglais 05.06.2014 Livre de poche Fr. 45.90 3-5 semaines
B. M. Clemens, B. M. (Stanford University Clemens, B. M. Johnson Clemens, B. M. Clemens, Clemens B. M., W. L. Johnson... - Thin Film Structures and Phase Stability: Volume 187
B. M. Clemens, B. M. (Stanford University Clemens, B. M. Johnson Clemens, B. M. Clemens, Clemens B. M., W. L. Johnson... Thin Film Structures and Phase Stability: Volume 187 Anglais 05.06.2014 Livre de poche Fr. 45.90 3-5 semaines
Avishay Katz, Avishay (At&t Bell Laboratories Katz, Avishay Murarka Katz, Ami Appelbaum, Appelbaum Ami, Avishay Katz... - Advanced Metallizations in Microelectronics: Volume 181
Avishay Katz, Avishay (At&t Bell Laboratories Katz, Avishay Murarka Katz, Ami Appelbaum, Appelbaum Ami, Avishay Katz... Advanced Metallizations in Microelectronics: Volume 181 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
R. D. Bringans, R. D. (Xerox Palo Alto Research Center Bringans, R. D. Feenstra Bringans, R. D. Bringans, Bringans R. D., R. M. Feenstra... - Atomic Scale Structure of Interfaces: Volume 159
R. D. Bringans, R. D. (Xerox Palo Alto Research Center Bringans, R. D. Feenstra Bringans, R. D. Bringans, Bringans R. D., R. M. Feenstra... Atomic Scale Structure of Interfaces: Volume 159 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Mihal E. Gross, Mihal E. Jasinski Gross, Mihal E. Gross, Gross Mihal E., Joseph M. Jasinski, Jasinski Joseph M.... - Chemical Perspectives of Microelectronic Materials: Volume 131
Mihal E. Gross, Mihal E. Jasinski Gross, Mihal E. Gross, Gross Mihal E., Joseph M. Jasinski, Jasinski Joseph M.... Chemical Perspectives of Microelectronic Materials: Volume 131 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
M. M. J. Treacy, M. M. J. Thomas Treacy, J. M. Thomas, Thomas J. M., M. M. J. Treacy, Treacy M. M. J.... - Microstructure and Properties of Catalysts: Volume 111
M. M. J. Treacy, M. M. J. Thomas Treacy, J. M. Thomas, Thomas J. M., M. M. J. Treacy, Treacy M. M. J.... Microstructure and Properties of Catalysts: Volume 111 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
R. B. Ceder Schwarz, Ricardo B. Schwarz, Ricardo B. (Los Alamos National Laborator Schwarz, Ricardo B. Ceder Schwarz, Gerbrand Ceder, Ceder Gerbrand... - Materials for Energy Storage, Generation and Transport: Volume 730
R. B. Ceder Schwarz, Ricardo B. Schwarz, Ricardo B. (Los Alamos National Laborator Schwarz, Ricardo B. Ceder Schwarz, Gerbrand Ceder, Ceder Gerbrand... Materials for Energy Storage, Generation and Transport: Volume 730 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Douglas B. Chrisey, Douglas B. Gamota Chrisey, Douglas B. Chrisey, Chrisey Douglas B., Daniel R. Gamota, Gamota Daniel R.... - Materials Development for Direct Write Technologies: Volume 624
Douglas B. Chrisey, Douglas B. Gamota Chrisey, Douglas B. Chrisey, Chrisey Douglas B., Daniel R. Gamota, Gamota Daniel R.... Materials Development for Direct Write Technologies: Volume 624 Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
Kevin L. Jensen, Kevin L. Nemanich Jensen, Paul Holloway, Holloway Paul, Itoh Junji, Kevin L. Jensen... - Electron Emissive Materials, Vacuum Microelectronics and Flat Panel
Kevin L. Jensen, Kevin L. Nemanich Jensen, Paul Holloway, Holloway Paul, Itoh Junji, Kevin L. Jensen... Electron Emissive Materials, Vacuum Microelectronics and Flat Panel Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines
G. S. Oehrlein, G. S. Maex Oehrlein, Y. -C Joo, Y. -C. Joo, K. Maex, G. S. Oehrlein... - Materials, Technology and Reliability for Advanced Interconnects and
G. S. Oehrlein, G. S. Maex Oehrlein, Y. -C Joo, Y. -C. Joo, K. Maex, G. S. Oehrlein... Materials, Technology and Reliability for Advanced Interconnects and Anglais 05.06.2014 Livre de poche Fr. 47.90 3-5 semaines