NANO AND MICROMACHINING

Informationen zum Autor J. Paul Davim works for KINNSYS, Brussels, Belgium. Mark Jackson works for Jackson Ashcroft Associates, London, UK. Klappentext This book provides the fundamentals and recent advances in nano and micromachining for modern manufacturing engineering. It begins by outlining nanomachining before discussing various advances in field and machining processes. The coverage concludes with an evaluation of subsurface damages in nano and micromachining and a presentation of applications in industry. As such, this book serves both as a useful classroom text for engineering and machining courses at the undergraduate and graduate level, and as a reference for academics and engineers in these areas. Zusammenfassung This book provides the fundamentals and recent advances in nano and micromachining for modern manufacturing engineering. It begins by outlining nanomachining before discussing various advances in field and machining processes. Inhaltsverzeichnis Preface ix Chapter 1. Nanoscale Cutting 1 Rüdiger RENTSCH 1.1. Introduction 1 1.2. Basic elements of molecular dynamics modeling 3 1.2.1. Material representation and microstructure 3 1.2.2. Atomic interaction 4 1.2.3. System dynamics and numerical description 7 1.2.4. Boundary conditions 8 1.3. Design and requirements for state-of-the-art MD cutting process simulations 10 1.4. Capabilities of MD for nanoscale material removal process analysis 12 1.4.1. Analysis of microstructure and deformation 12 1.4.2. Obtaining cutting forces, stress and temperature 15 1.5. Advances and recent developments in material removal process simulation 18 1.5.1. Complete 3D surface machining simulation 18 1.5.2. Consideration of fluids in MD cutting simulation 20 1.6. Summary and outlook 23 1.7. References 24 Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces 27 Xiaoping LI 2.1. Introduction 27 2.2. The mechanism of ductile mode cutting of brittle materials 29 2.2.1. Transition of chip formation mode from ductile to brittle 29 2.2.2. MD modeling and simulation of nanoscale ductile mode cutting of silicon 32 2.2.3. The mechanism of ductile mode chip formation in cutting of silicon 32 2.3. The chip formation in cutting of brittle materials 35 2.3.1. Material deformation and crack initiation in the chip formation zone 35 2.3.2. Stress conditions in the chip formation zone in relation to ductile-brittle mode of chip formation 36 2.4. Machined surfaces in relation to chip formation mode 38 2.5. References 40 Chapter 3. Diamond Tools in Micromachining 45 Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD 3.1. Introduction 45 3.2. Diamond technology 45 3.2.1. Hot Filament CVD (HFCVD) 46 3.3. Preparation of substrate 48 3.3.1. Selection of substrate material 48 3.3.2. Pre-treatment of substrate 49 3.4. Modified HFCVD process 51 3.4.1. Modification of filament assembly 51 3.4.2. Process conditions 52 3.5. Nucleation and diamond growth 53 3.5.1. Nucleation 54 3.5.2. Bias-enhanced nucleation (BEN) 55 3.5.3. Influence of temperature 56 3.6. Deposition on complex substrates 58 3.6.1. Diamond deposition on metallic (molybdenum) wire 58 3.6.2. Deposition on WC-Co microtools 58 3.6.3. Diamond deposition on tungsten carbide (WC-Co) microtool 59 3.7. Diamond micromachining 62 3.7.1. Performance of diamond-coated microtool 66 3.8. Conclusions 67 3.9. References 67 Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling 71 Wit GRZESIK

Inhaltsverzeichnis

Preface ix

Chapter 1. Nanoscale Cutting 1
Rüdiger RENTSCH

1.1. Introduction 1

1.2. Basic elements of molecular dynamics modeling 3

1.2.1. Material representation and microstructure 3

1.2.2. Atomic interaction 4

1.2.3. System dynamics and numerical description 7

1.2.4. Boundary conditions 8

1.3. Design and requirements for state-of-the-art MD cutting process simulations 10

1.4. Capabilities of MD for nanoscale material removal process analysis 12

1.4.1. Analysis of microstructure and deformation 12

1.4.2. Obtaining cutting forces, stress and temperature 15

1.5. Advances and recent developments in material removal process simulation 18

1.5.1. Complete 3D surface machining simulation 18

1.5.2. Consideration of fluids in MD cutting simulation 20

1.6. Summary and outlook 23

1.7. References 24

Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces 27
Xiaoping LI

2.1. Introduction 27

2.2. The mechanism of ductile mode cutting of brittle materials 29

2.2.1. Transition of chip formation mode from ductile to brittle 29

2.2.2. MD modeling and simulation of nanoscale ductile mode cutting of silicon 32

2.2.3. The mechanism of ductile mode chip formation in cutting of silicon 32

2.3. The chip formation in cutting of brittle materials 35

2.3.1. Material deformation and crack initiation in the chip formation zone 35

2.3.2. Stress conditions in the chip formation zone in relation to ductile-brittle mode of chip formation 36

2.4. Machined surfaces in relation to chip formation mode 38

2.5. References 40

Chapter 3. Diamond Tools in Micromachining 45
Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD

3.1. Introduction 45

3.2. Diamond technology 45

3.2.1. Hot Filament CVD (HFCVD) 46

3.3. Preparation of substrate 48

3.3.1. Selection of substrate material 48

3.3.2. Pre-treatment of substrate 49

3.4. Modified HFCVD process 51

3.4.1. Modification of filament assembly 51

3.4.2. Process conditions 52

3.5. Nucleation and diamond growth 53

3.5.1. Nucleation 54

3.5.2. Bias-enhanced nucleation (BEN) 55

3.5.3. Influence of temperature 56

3.6. Deposition on complex substrates 58

3.6.1. Diamond deposition on metallic (molybdenum) wire 58

3.6.2. Deposition on WC-Co microtools 58

3.6.3. Diamond deposition on tungsten carbide (WC-Co) microtool 59

3.7. Diamond micromachining 62

3.7.1. Performance of diamond-coated microtool 66

3.8. Conclusions 67

3.9. References 67

Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling 71
Wit GRZESIK

4.1. Introduction 71

4.1.1. Definitions and technological possibilities 71

4.1.2. Main applications of micromachining 72

4.2. Microturning 74

4.2.1. Characteristic features and applications 74

4.2.2. Microturning tools and tooling systems 75

4.2.3. Machine tools for microturning 77

4.3. Microdrilling 79

4.3.1. Characteristic features and applications 79

4.3.2. Microdrills and tooling systems 80

4.3.3. Machine tools for microdrilling 83

4.4. Micromilling 85

4.4.1. Characteristic features and applications 85

4.4.2. Micromills and tooling systems 87

4.4.3. Machine tools for micromilling 89

4.5. Product quality in micromachining 92

4.5.1. Quality challenges in micromachining 92

4.5.2. Burr formation in micromachining operations 92

4.5.3. Surface quality inspection of micromachining products 96

4.6. References 98

Chapter 5. Microgrinding and Ultra-precision Processes 101
Mark J. JACKSON and Michael D. WHITFIELD

5.1. Introduction 101

5.2. Micro and nanogrinding 104

5.2.1. Nanogrinding apparatus. 105

5.2.2. Nanogrinding procedures 105

5.3. Nanogrinding tools 106

5.3.1. Dissolution modeling 109

5.3.2. Preparation of nanogrinding wheels 110

5.3.3. Bonding systems 112

5.3.4. Vitrified bonding systems 113

5.4. Conclusions 121

Produktdetails

• Autoren: DAVIM, J Pau Davim, J Paul Davim, J. Paul Davim, Joao P. Davim, João P. Davim, João Paulo Davim, JP Davim, Mark J Jackson, Mark J. Jackson
• Mitarbeit: J. Paulo Davim (Herausgeber), João P. Davim (Herausgeber), João Paulo Davim (Herausgeber), Dr. Mark J. Jackson (Herausgeber), Mark J. Jackson (Herausgeber)
• Verlag: Import Diff
• Sprache: Englisch
• Produktform: Taschenbuch
• Erschienen: 29.11.2008
• EAN: 9781848211032
• ISBN: 978-1-84821-103-2
• Serien: ISTE; ISTE
• Themen: Naturwissenschaften, Medizin, Informatik, Technik > Technik > Elektronik, Elektrotechnik, Nachrichtentechnik; Sachbuch > Natur, Technik; Maschinenbau, Nanotechnologie, Mikrosystemtechnik, Mechanical Engineering, Nanotechnology, Nanomaterialien, Nanomaterials, Electrical & Electronics Engineering, Elektrotechnik u. Elektronik, MEMS, Allg. Maschinenbau