Mehr lesen
The fourth edition of
Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures.
Inhaltsverzeichnis
1. ISSUES IN ELECTRONICS PACKAGING DESIGN. 2. BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION. 3. CONDUCTIVE COOLING. 4. RADIATION COOLING. 5. FUNDAMENTALS OF CONVECTION COOLING. 6. COMBINED MODES, TRANSIENT HEAT TRANSFER AND ADVANCED MATERIALS. 7. BASICS OF VIBRATION AND ITS ISOLATION. 8. BASICS OF SHOCK MANAGEMENT. 9. INDUCED STRESSE. 10. ERROR PROOFING MEASUREMENTS. 11. MECHANICAL AND THERMOMECHANICAL CONCERNS.12. ACOUSTICS. 13. MECHANICAL FAILURES AND RELIABILITY. 14. ELECTRICAL FAILURES AND RELIABILITY. 15. CHEMICAL ATTACK FAILURES AND RELIABILITY. 16. RELIABILITY MODELS, PREDICTIONS AND CALCULATIONS. 17. DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE
Über den Autor / die Autorin
Dr. Jamnia has published four books with CRC Press, a large number of engineering papers and presentations as well as non-technical articles along with a number of patents. He has a demonstrated basic understanding of the engineering principles particularly in the areas of fluid flow, heat transfer and stress analysis. His primary expertise lies in electromechanical systems design and analysis particularly using numerical approximations and computer simulation. Currently, he heads design for reliability, compliance and safety activities for a medical device company.
His focus on the issues of electronics packaging began in the early 90's. And since 1995, he has been involved with the design and development of innovative electronics system particularly in the medical field. His prime achievement was the development of a specialized computer systems called the Learning Stationä to be used as teaching tool for individuals with cognitive delays and/or physical disabilities.
Dr. Jamnia enjoys teaching and interacting with others. In fact, Society for Automotive Engineers (SAE) had sponsored him for nearly ten years to teach workshops on electronics packaging form a thermal and mechanical design and analysis point of view.
