Fr. 76.00

Metaverse - METAVERSE 2023 - 19th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23-26, 2023, Proceedings

Englisch · Taschenbuch

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Beschreibung

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This book constitutes the refereed proceedings of the 19th International Conference on Metaverse, METAVERSE 2023, held in Honolulu, HI, USA, during September 23-26, 2023.
The 9 full papers and 3 short papers included in this book were carefully reviewed and selected from 15 submissions. They were organized in topical sections as follows: answer set programming; metaverse engineering foundations and applications, with a focus on novel approaches for engineering requirements, design and architectures, testing, maintenance and evolution, model-driven development, software processes, metrics, quality assurance and new software economics models, search-based software engineering, benefiting day-to-day services sectors and derived through experiences, with appreciation to scale, pragmatism, transparency, compliance and/or dependability.

Inhaltsverzeichnis

Research Track.- CEESys: A Cloud-Edge-End System for Data Acquisition, Transmission and Processing Based on HiSilicon and OpenHarmony.- YOLO-IMF: An Improved YOLOv8 Algorithm for Surface Defect Detection in Industrial Manufacturing Field.- The Path Analysis of Applying VR Technology to University Ideological and Political Theory Courses.- Application of the Metaverse in Product Engineering - A Workshop for Identification of Potential Field of Action.- Application and Industry Track.- Carbon Neutrality in Smart Tech-Parks: Leveraging Metaverse and Energy Management Application.- Research on the Construction of Teaching Evaluation Model Based on Big Data.- Short Paper Track.- CBDC - an Alternative to Cryptocurrency in the Metaverse an Indian Perspective.- Research on the Application of Metaverse Technology in the Field of Intelligent Transportation.- Metaverse Applications for Construction of Educational Digital Resources.

Produktdetails

Mitarbeit Sheng He (Herausgeber), Jiacai Lai (Herausgeber), Liang-Jie Zhang (Herausgeber)
Verlag Springer, Berlin
 
Sprache Englisch
Produktform Taschenbuch
Erschienen 01.10.2023
 
EAN 9783031447532
ISBN 978-3-0-3144753-2
Seiten 121
Abmessung 155 mm x 7 mm x 235 mm
Illustration XVI, 121 p. 42 illus., 31 illus. in color.
Serie Lecture Notes in Computer Science
Thema Naturwissenschaften, Medizin, Informatik, Technik > Informatik, EDV > Informatik

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