RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Inhaltsverzeichnis

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

Zusammenfassung

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Produktdetails

• Mitarbeit: Sean S. Cahill (Herausgeber), Frankli Kim (Herausgeber), Franklin Kim (Herausgeber), Ken Kuang (Herausgeber), Sean S Cahill (Herausgeber)
• Verlag: Springer, Berlin
• Sprache: Englisch
• Produktform: Taschenbuch
• Erschienen: 01.01.2014
• EAN: 9781489983244
• ISBN: 978-1-4899-8324-4
• Seiten: 285
• Abmessung: 155 mm x 235 mm x 16 mm
• Gewicht: 468 g
• Illustration: XVI, 285 p.
• Serien: RF and Microwave Microelectronics Packaging; RF and Microwave Microelectronics Packaging
• Themen: Naturwissenschaften, Medizin, Informatik, Technik > Technik > Elektronik, Elektrotechnik, Nachrichtentechnik; C, engineering, Microwaves, RF and Optical Engineering, Microwaves, RF Engineering and Optical Communications, Circuits and Systems, Electronics, Microelectronics, Electronics and Microelectronics, Instrumentation, Electronic circuits, Electronic Circuits and Systems, Electronics: circuits & components, Optical engineering, Microwaves, Microwave technology