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The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication , Sixth Editionexplains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technologicalbackbone of the high-tech industry.
COVERAGE INCLUDES:
The semiconductor industry
Properties of semiconductor materials and chemicals
Crystal growth and silicon wafer preparation
Wafer fabrication and packaging
Contamination control
Productivity and process yields
Oxidation
The ten-step patterning process--surface preparation to exposure; developing to final inspection
Next generation lithography
Doping
Layer deposition
Metallization
Process and device evaluation
The business of wafer fabrication
Devices and integrated circuit formation
Integrated circuits
Packaging
Inhaltsverzeichnis
Ch 1. The Semiconductor Industry
Ch 2. Properties of Semiconductor Materials and Chemicals
Ch 3. Crystal Growth and Silicon Wafer Preparation
Ch 4. Overview of Wafer Fabrication
Ch 5. Contamination Control
Ch 6. Productivity and Process Yields
Ch 7. Oxidation
Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
Ch 10. Advanced Photolithography Processes
Ch 11. Doping
Ch 12. Layer Deposition
Ch 13. Metalization
Ch 14. Process and Device Evaluation
Ch 15. The Business of Water Fabrication
Ch 16. Introduction to Device and Integrated Circuit Formation
Ch 17. Introduction to Integrated Circuits
Ch 18. Packaging
Glossary
Index
Über den Autor / die Autorin
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.
Zusammenfassung
Fully revised to cover the latest advances in the field, this new edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. Detailed illustrations and real-world examples are included.
