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Krishnendu Chakrabarty, Amla Ganguly, Amlan Ganguly, Partha Pratim Pande - Design Technologies for Green and Sustainable Computing Systems
Krishnendu Chakrabarty, Amla Ganguly, Amlan Ganguly, Partha Pratim Pande Design Technologies for Green and Sustainable Computing Systems Englisch 01.01.2013 Taschenbuch Fr. 149.00 6-7 Wochen
Krishnend Chakrabarty, Krishnendu Chakrabarty, Tsung-Yi Ho, Ka Hu, Kai Hu - Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips
Krishnend Chakrabarty, Krishnendu Chakrabarty, Tsung-Yi Ho, Ka Hu, Kai Hu Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Englisch 01.01.2018 Taschenbuch Fr. 135.00 6-7 Wochen
Krishnendu Chakrabarty, Ra Wang, Ran Wang - Testing of Interposer-Based 2.5D Integrated Circuits
Krishnendu Chakrabarty, Ra Wang, Ran Wang Testing of Interposer-Based 2.5D Integrated Circuits Englisch 01.01.2018 Taschenbuch Fr. 147.00 6-7 Wochen
Krishnend Chakrabarty, Krishnendu Chakrabarty, Mohame Ibrahim, Mohamed Ibrahim, Ramesh Karri, Jac Tang... - Secure and Trustworthy Cyberphysical Microfluidic Biochips
Krishnend Chakrabarty, Krishnendu Chakrabarty, Mohame Ibrahim, Mohamed Ibrahim, Ramesh Karri, Jac Tang... Secure and Trustworthy Cyberphysical Microfluidic Biochips Englisch 01.01.2019 Fester Einband Fr. 135.00 6-7 Wochen
Krishnendu Chakrabarty, Ra Wang, Ran Wang - Testing of Interposer-Based 2.5D Integrated Circuits
Krishnendu Chakrabarty, Ra Wang, Ran Wang Testing of Interposer-Based 2.5D Integrated Circuits Englisch 30.04.2017 Fester Einband Fr. 135.00 6-7 Wochen
Krishnendu Chakrabarty, Brando Noia, Brandon Noia - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Krishnendu Chakrabarty, Brando Noia, Brandon Noia Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Englisch 01.01.2016 Taschenbuch Fr. 139.00 6-7 Wochen
Krishnendu Chakrabarty, Brando Noia, Brandon Noia - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Krishnendu Chakrabarty, Brando Noia, Brandon Noia Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Englisch 31.12.2013 Fester Einband Fr. 135.00 6-7 Wochen