Fr. 208.00

On-Chip Interconnect with aelite - Composable and Predictable Systems

Inglese · Copertina rigida

Spedizione di solito entro 3 a 5 settimane (il titolo viene procurato in modo speciale)

Descrizione

Ulteriori informazioni

The book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip (NoC). The presentation offers a systems perspective, starting from the system requirements and deriving and describing the resulting hardware architectures, embedded software, and accompanying design flow. Readers get an in depth view of the interconnect requirements, not centered only on performance and scalability, but also the multi-faceted, application-driven requirements, in particular composability and predictability. The book shows how these qualitative requirements are implemented in a state-of-the-art on-chip interconnect, and presents the realistic, quantitative costs.

Sommario


Introduction; Proposed Solution; Dimensioning; Allocation; Instantiation; Verification; Case Study; Related Work; Conclusions and Future Work.

Riassunto

The book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip (NoC). The presentation offers a systems perspective, starting from the system requirements and deriving and describing the resulting hardware architectures, embedded software, and accompanying design flow. Readers get an in depth view of the interconnect requirements, not centered only on performance and scalability, but also the multi-faceted, application-driven requirements, in particular composability and predictability. The book shows how these qualitative requirements are implemented in a state-of-the-art on-chip interconnect, and presents the realistic, quantitative costs.

Dettagli sul prodotto

Autori Kees Goossens, Andrea Hansson, Andreas Hansson
Editore Springer, Berlin
 
Lingue Inglese
Formato Copertina rigida
Pubblicazione 22.11.2010
 
EAN 9781441964960
ISBN 978-1-4419-6496-0
Pagine 210
Dimensioni 160 mm x 242 mm x 17 mm
Peso 472 g
Illustrazioni X, 210 p.
Serie Embedded Systems
Embedded Systems
Categoria Scienze naturali, medicina, informatica, tecnica > Tecnica > Elettronica, elettrotecnica, telecomunicazioni

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