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Informationen zum Autor AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD. Klappentext This Second Edition focuses on emerging topics and advances in the field of VLSI interconnectionsIn the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:*Preliminary Concepts*Parasitic Resistances, Capacitances, and Inductances*Interconnection Delays*Crosstalk Analysis*Electromigration-Induced Failure Analysis*Future InterconnectionsHigh-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering. Zusammenfassung Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Inhaltsverzeichnis Preface. 1. Preliminary Concepts and More. 1.1 Interconnections for VLSI Applications. 1.1.1 Metallic Interconnections - Multilevel, Multilayer and Multipath Configurations. 1.1.2 Optical Interconnections. 1.1.3 Superconducting Interconnections. 1.2 Copper Interconnections. 1.2.1 Advantages of Copper Interconnections. 1.2.2 Challenges Posed by Copper Interconnections. 1.2.3 Fabrication Processes for Copper Interconnections. 1.2.4 Damascene Processing of Copper Interconnections. 1.3 Method of Images. 1.4 Method of Moments. 1.5 Even and Odd Mode Capacitances. 1.5.1 Two Coupled Conductors. 1.5.2 Three Coupled Conductors. 1.6 Transmission Line Equations. 1.7 Miller's Theorem. 1.8 Inverse Laplace Transformation. 1.9 A Resistive Interconnection as a Ladder Network. 1.9.1 Open Circuit Interconnection. 1.9.2 Short Circuited Interconnection. 1.9.3 Application of the Ladder Approximation to a Multipath Interconnection. 1.10 Propagation Modes in a Microstrip Interconnection. 1.11 Slow-Wave Mode Propagation. 1.11.1 Quasi-TEM Analysis. 1.11.2 Comparison with Experimental Results. 1.12 Propagation Delays. Exercises. References. 2. Parasitic Resistances, Capacitances and Inductances. 2.1 Parasitic Resistances - General Considerations. 2.2 Parasitic Capacitances - General Considerations. 2.2.1 Parallel Plate Capacitance. 2.2.2 Fringing Capacitances. 2.2.3 Coupling Capacitances. 2.3 Parasitic Inductances - General Considerations. 2.3.1 Self and Mutual Inductances. 2.3.2 Partial Inductances. 2.3.3 Methods for Inductance Extraction. 2.3.4 Effect of Inductances on Interconnection Delays. 2.4 Approximate Formulas for Capacitances. 2.4.1 Single Line on a Ground Plane. 2.4.2 Two Lines on a Ground ...
