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This book explores the state-of-the-art advancements in the terahertz (THz), millimeter-wave (mm-wave), and infrared (IR) technologies. By bridging the gap between electronics and photonics, it explores wide-bandgap semiconductors, nanostructures, nanomaterials, photonic integration, and quantum confinement technologies, linking foundational physics with practical applications. Challenges such as scaling limitations, thermal management, and noise suppression are discussed alongside emerging solutions like artificial intelligence, metamaterials, and hybrid systems. The volume one caters to undergraduate and postgraduate students, researchers, and professionals seeking a comprehensive resource on cutting-edge innovations in communication, imaging, and sensing technologies.
Sommario
Introduction to Next-Generation High-Speed Electronics and Optoelectronics (Vol. 1).- DFT Investigation of Fe/SrO/Fe, Ni/SrO/Ni, and Co/SrO/Co Junction.- A Performance study of Raised Source Drain Double Gate JLFET for Electric Vehicles.- Wide Band Gap Semiconductor Transit Time Sources for Terahertz IMPATTs.- Multi-Threshold 2:1-Multiplexer based Novel UT-Vedic 4×4-bit Multiplier.- Ambipolarity Reduction and Upsurge in ION/IAmb Ratio of Traditional Tunnel FETs An Extensive Comparative Review.- Dual-Fin FinFET Configuration for High-Performance RF and Analog Applications in Low-Power Regimes.- Efficient Arcsine/Arccosine Computation Using CORDIC with LUT and Input-Gain Compensation.- Neural Augmented Optical Correction: High-Fidelity Mask Optimization via Mixed Point Spread Function Learning and Sub Resolution Assist Feature Aware Richardson-Lucy Deconvolution.- Comparison and Analysis of Dynamic Comparator Using Different Novel Techniques With 45nm and 22nm Technologies.- HivePatch: A Dual-Band Honeycomb-Slotted Array and MIMO Microstrip Antenna for Terahertz 6G Connectivity.- Obstacle-Aware Routing Algorithm for Graphene Nanoribbon Interconnects.- Low-Power Multiplier-Less VLSI Design and Implementation of Linear Convolution Using Vedic Mathematics.- Validating the Multi-Level Switching of Memristor Device in a Simulative Framework for Circuit Implementation with Empirical Measurement.- Advancements in Memristor-Based Audio Processing for Hearing Aid Technologies.- Heterojunction Source Pocket Ferroelectric Aided Tunnel TFET Could Boosts Crucial Figures of Merit for Low Power Applications.
Info autore
Dr. Aritra Acharyya is Assistant Professor in the Department of Electronics and Communication Engineering at Kalyani Government Engineering College, West Bengal, since July 2024. He previously served as Assistant Professor in the Department of ECE, Cooch Behar Government Engineering College, from May 2016 to July 2024. Born in 1986, he received his B.E. from IIEST Shibpur in 2007, M.Tech. from the Institute of Radio Physics and Electronics, University of Calcutta, in 2010, and Ph.D. from the same institute in 2016. His research interests include high-frequency semiconductor devices, nanostructures, semiconductor physics, transport phenomena, quantum mechanics, and optoelectronics. He has published 102 papers in peer-reviewed journals, 72 papers in national and international conference proceedings, and several book chapters. He has also authored and edited 14 books.
Professor (Dr.) Angsuman Sarkar is Professor and Head of Electronics and Communication Engineering at Kalyani Government Engineering College, West Bengal. He previously served at Jalpaiguri GEC and KGEC as Lecturer, Assistant and Associate Professor for over 23 years. He earned his M.Tech. in VLSI and microelectronics and Ph.D. from Jadavpur University. His research focuses on short-channel effects of sub-100 nm MOSFETs and nano device modeling. He is Senior Member of IEEE, Fellow of IE(I) and IETE, Life Member of ISTE, and Former Chairman of IEEE EDS Kolkata Chapter. He has authored 6 books, 23 book chapters, 110 international journal papers, and 68 conference papers. Featured in the “World Ranking of Top 2% Scientists” in Nanoscience and Nanotechnology by Stanford University and Elsevier, he also serves on editorial boards and reviews for leading journals. Currently, he supervises 8 Ph.D. scholars and has guided 9 to completion.
Dr. Mariya Aleksandrova is Associate Professor of Fabrication Technology of Electronics at the Department of Microelectronics, Technical University of Sofia. She received her master’s in electronic engineering in 2007 and Ph.D. in 2010, focusing on interface optimization in organic light-emitting devices. After five years as Assistant Professor, she became Associate Professor in 2015. Her research has evolved from flexible polymeric light-emitting devices to flexible and wearable electronics, energy harvesting, and thin-film supercapacitors integrated with PCBs. Since 2018, her group has emphasized energy harvesting technologies. She leads the laboratories “Thin-film Electronics,” “Photolithography,” and “Quality and Reliability in Automotive Electronics.” Dr. Aleksandrova has designed seven core curricula at the Faculty of Electronic Engineering and Technology, including courses on micro- and nanosystems, thin-film electronics, and energy harvesting technologies. She has contributed to numerous national and international projects and authored 3 books, 5 book chapters, and over 120 peer-reviewed papers.
Riassunto
This book explores the state-of-the-art advancements in the terahertz (THz), millimeter-wave (mm-wave), and infrared (IR) technologies. By bridging the gap between electronics and photonics, it explores wide-bandgap semiconductors, nanostructures, nanomaterials, photonic integration, and quantum confinement technologies, linking foundational physics with practical applications. Challenges such as scaling limitations, thermal management, and noise suppression are discussed alongside emerging solutions like artificial intelligence, metamaterials, and hybrid systems. The volume one caters to undergraduate and postgraduate students, researchers, and professionals seeking a comprehensive resource on cutting-edge innovations in communication, imaging, and sensing technologies.
