Ulteriori informazioni
This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.
Sommario
- Chapter 1: Heat in integrated circuits and systems
- Chapter 2: On-chip temperature sensing
- Chapter 3: Dynamic thermal management
- Chapter 4: Active cooling
- Chapter 5: Mitigating thermal events at the system level and above
- Chapter 6: Emerging directions in thermal-aware systems
- Appendix A: Relevant units and metrics
Info autore
Seda Ogrenci-Memik is an Associate Professor at the Electrical Engineering and Computer Science Department of Northwestern University, Illinois, where her research interests include thermal-aware design and management of high performance systems, embedded and reconfigurable computing, and thermal sensing technologies. Dr Ogrenci-Memik has served as technical program chair, committee member, organizing committee member, and track chair of several conferences, including ICCAD, DAC, DATE, EUC, FPL, GLSVLSI, and ISVLSI and she has served on the Editorial Board of
IEEE Transactions on VLSI.
Riassunto
This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.
