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Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package without the use of phase change materials(PCM). A numerical thermal model was developed and validated. CFD Simulation is performed for PCM and non-PCM based material studies. Relevant thermal performance data were obtained to show the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement found between the numerical and the measured data. A novel PCM-based passive thermal control of electronic devices was investigated experimentally. A tall enclosure with uniform/discrete heat sources applied on sides for PCM melting and another with a PCM-filled heat sink setup developed and tested. PCM-based cooling technique is attractive thermal concept for transient applications. Effects of various parameters on melting/freezing times were studied. Flow visualization experiments were also made to determine the PCM melting rates. Finally, a 2D numerical study was conducted to compare simulation results with experimental data.
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Professor Arun S. Mujumdar; PhD McGill University, Montreal; Professor of Chemical Engineering, McGill University, until July 2000; Visiting Professor at numerous universities; Honorary Professor of five universities in China; President and Principal Consultant, Exergex Corp., Canada 1989-2000; consultant for over 60 companies; authored 2 books and over 60 book chapters, edited or co-edited over 50 books and journals; published more than 300 research papers, presented over 200 conference papers; external reviewer for various research councils; founder, chair or member of organizing panels for numerous major international conferences; elected Fellow of American Society of Mechanical Engineers, Chemical Institute of Canada and Inst. Chem. Eng. (India); member of AIChE, CPPA, Sigma Xi; awarded Senior Fellowship by Japan Society for Promotion of Science (1988 and 1996), Innovation in Drying Award, IDS '86, MIT, The Procter & Gamble Award for Excellence in Drying Research (1998); named Distinguished Scientists of the 20th Century, International Man of the Year by International Biographical Institute, Cambridge (1999); listed in 1000 World Leaders of Influence by the American Biographical Institute, Raleigh, USA (2000).
