Fr. 146.00

Advanced Analysis of Nontraditional Machining

Inglese · Tascabile

Spedizione di solito entro 1 a 2 settimane (il titolo viene stampato sull'ordine)

Descrizione

Ulteriori informazioni

Nontraditional machining utilizes thermal, chemical, electrical, mechanical and optimal sources of energy to bind, form and cut materials. Advanced Analysis of Nontraditional Machining explains in-depth how each of these advanced machining processes work, their machining system components, and process variables and industrial applications, thereby offering advanced knowledge and scientific insight. This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

Sommario

Laser Machining and Its Associated Effects.- Electrical Discharge Machining.- Electrochemical Machining.- Chemical Mechanical Polishing.- Ultrasonic Machining.- Water Jet Machining.- Micromachining by Photonic Beams.- Material Shaping by Ion and Electron Nanobeams.

Info autore










Hong Hocheng, National Tsing Hua University, hocheng@pme.nthu.edu.tw

Hung-Yin Tsai, National Tsing Hua University, hytsai@pme.nthu.edu.tw

Riassunto

Nontraditional machining utilizes thermal, chemical, electrical, mechanical and optimal sources of energy to bind, form and cut materials. Advanced Analysis of Nontraditional Machining explains in-depth how each of these advanced machining processes work, their machining system components, and process variables and industrial applications, thereby offering advanced knowledge and scientific insight. This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

Dettagli sul prodotto

Con la collaborazione di Hon Hocheng (Editore), Hong Hocheng (Editore), TSAI (Editore), Tsai (Editore), Hung-Yin Tsai (Editore)
Editore Springer, Berlin
 
Lingue Inglese
Formato Tascabile
Pubblicazione 01.01.2012
 
EAN 9781489995438
ISBN 978-1-4899-9543-8
Pagine 504
Dimensioni 157 mm x 236 mm x 29 mm
Peso 777 g
Illustrazioni VIII, 504 p.
Categorie Scienze naturali, medicina, informatica, tecnica > Tecnica > Meccanica, tecnica di produzione

B, engineering, Solid Mechanics, Machinery, Testing of materials, Characterization and Analytical Technique, Materials science, Characterization and Evaluation of Materials, Mechanics, Mechanics of solids, Mechanics, Applied, Machinery and Machine Elements

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