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Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques.
Sommario
Preface_xi
1 Wafers and Semiconductors 3
1.1 Introduction 3
1.2 Semiconductor Revolution 3
1.2.1 Classification of materials 3
1.2.2 Semiconductor revolution today 6
1.2.3 Silicon wafers and solar cells 8
1.3 Silicon Wafers Used in Device Manufacturing (IC and MEMS) 8
1.3.1 Standard wafer diameters and sizes 9
1.3.2 Crystalline orientation of silicon wafers 11
1.3.3 The Moore's Law 13
1.4 Surface Properties and Quality Measurements of Wafers 14
1.4.1 Surface waviness: TTV, bow, and warp 14
1.4.2 Discussion on warp 19
1.4.3 Automated measurements of TTV, warp, bow and flatness 20
1.4.4 Wafer flatness 21
1.4.5 Nanotopography or Nanotopology 27
1.4.6 Surface roughness 28
1.5 Other Properties and Quality Requirements of Silicon Wafers 34
1.5.1 Mechanical and material properties 34
1.5.2 Property of silicon with anisotropy 34
1.5.3 Gravity-induced deflection of wafers 38
1.5.4 Wafer edge properties 39
1.6 Economics ofWafer Manufacturing 41
1.6.1 Three categories of wafers 41
1.6.2 Cost of silicon wafers 43
1.7 Summary 45
References 46
2 WaferManufacturing: Generalized Processes and Flow 49
2.1 Introduction 49
2.2 Wafer Manufacturing: Generalized Process Flow 50
2.3 Crystal Growth 51
2.3.1 Melt growth 51
2.3.2 Vapor growth 61
2.3.3 Epitaxial growth 61
2.3.4 Casting polycrystalline crystal 63
2.3.5 Other crystal growth methods 64
2.4 Wafer Forming 64
2.4.1 Cropping 65
2.4.2 Trimming 65
2.4.3 Orientation identification 65
2.4.4 Slicing 65
2.4.5 Slicing using the Inner-diameter (ID) saw 66
2.4.6 Slicing using wiresaw 67
2.4.7 Other tools for slicing 68
2.4.8 Edge rounding 69
2.5 Wafer Polishing 71
2.5.1 Lapping 72
2.5.2 Grinding 72
2.5.3 Etching 73
2.5.4 Polishing 73
2.6 Wafer Preparing 74
2.6.1 Cleaning 74
2.6.2 Inspection 75
2.6.3 Packaging 75
2.7 Industrial Processes of Wafer Manufacturing 75
2.7.1 Crystal growth 76
2.7.2 Wafer forming 76
2.7.3 Wafer lapping and polishing 81
2.7.4 Wafer preparing 85
2.8 Summary 87
References 88
3 Process Modeling and Manufacturing Processes 91
3.1 Introduction 91
3.2 Wafer Manufacturing and Brittle Materials 92
3.3 Ductile Machining Versus Brittle Machining 94
3.4 Abrasive Machining in Wafer Manufacturing 95
3.4.1 Bonded abrasive machining (BAM) 96
3.4.2 Free abrasive machining (FAM) 97
3.5 Abrasive Materials 98
3.5.1 Classification of the grain size of abrasive materials 98
3.5.2 Hardness of abrasive materials 100
3.5.3 Commonly used abrasive materials in wafer manufacturing 102
3.6 Ductile Machining of Brittle Materials 105
3.6.1 Research on ductile machining and challenges 106
3.6.2 Opportunity and future research 106
3.7 Process Modeling of Manufacturing Processes 107
3.7.1 Rolling-indenting and scratching-indenting process models of FAM 108
3.7.2 Comparison between wiresawing and lapping 111
3.7.3 Other aspects of engineering modeling 113
3.8 Abrasive Slurry in FAM Processes 113
3.8.1 Composition of abrasive slurry 114
3.8.2 Comparison of water and
Info autore
Imin Kao, is Professor in the Department of Mechanical Engineering at the State University of New York in Stony Brook, USA. He is Faculty Director of the Undergraduate College in Information and Technology Studies. He holds three patents, and his research foci include robotic manipulation with soft contacts and smart contact surface technology using MEMS.
Chunhui Chung, is Associate Professor in the Department of Mechanical Engineering at the National Cheng Kung University in Taiwan.
Riassunto
Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques.
