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F.J. Schermer, Franz Jose Schermer, Franz Josef Schermer, Helmu Städele, Helmut Städele, Hel Strauss - BMW F 800 GS ab Modelljahr 2008
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Wei Wu - Printed Electronics for Smart Packaging
Wei Wu Printed Electronics for Smart Packaging Inglese 01.12.2025 Copertina rigida Fr. 168.00 4-7 giorni lavorativi
Liu, J. Liu, S. Liu, Shen Liu, Shen (Huazhong University of Science and Tech Liu, Shen (Huazhong University of Science and Technology Liu... - Led Packaging for Lighting Applications
Liu, J. Liu, S. Liu, Shen Liu, Shen (Huazhong University of Science and Tech Liu, Shen (Huazhong University of Science and Technology Liu... Led Packaging for Lighting Applications Inglese 01.10.2011 Copertina rigida Fr. 180.00 1-3 settimane (non disponibile a breve termine)
Claus M. Schneider, Klaus Wetzig, M Schneider, M Schneider, Claus M. Schneider, Klau Wetzig... - Metal Based Thin Films for Electronics
Claus M. Schneider, Klaus Wetzig, M Schneider, M Schneider, Claus M. Schneider, Klau Wetzig... Metal Based Thin Films for Electronics Inglese, Tedesco 31.03.2015 Copertina rigida Fr. 255.00 1-3 settimane (non disponibile a breve termine)
Richard Cameron, Richard J Cameron, Richard J. Cameron, Richard J. (Com Dev International) Kudsia Cameron, Richard J. Kudsia Cameron, Rj Cameron... - Microwave Filters for Communication Systems
Richard Cameron, Richard J Cameron, Richard J. Cameron, Richard J. (Com Dev International) Kudsia Cameron, Richard J. Kudsia Cameron, Rj Cameron... Microwave Filters for Communication Systems Inglese 25.05.2018 Copertina rigida Fr. 190.00 1-3 settimane (non disponibile a breve termine)
Stefano Grivet Talocia, Grivet-Talocia, S Grivet-Talocia, Stefan Grivet-Talocia, Stefano Grivet-Talocia, Stefano Gustavsen Grivet-Talocia... - Passive Macromodeling
Stefano Grivet Talocia, Grivet-Talocia, S Grivet-Talocia, Stefan Grivet-Talocia, Stefano Grivet-Talocia, Stefano Gustavsen Grivet-Talocia... Passive Macromodeling Inglese 22.01.2016 Copertina rigida Fr. 220.00 1-3 settimane (non disponibile a breve termine)
Shozo Nakamura, Shozo (Nakamura Technical Research Insti Nakamura, Nakamura Shozo - Polymeric Materials for Electronic Packaging
Shozo Nakamura, Shozo (Nakamura Technical Research Insti Nakamura, Nakamura Shozo Polymeric Materials for Electronic Packaging Inglese 31.08.2023 Copertina rigida Fr. 186.00 1-3 settimane (non disponibile a breve termine)
EP Li, Er-Ping Li, LI ER PING, Li Er-Ping - Electrical Modeling and Design for 3d System Integration
EP Li, Er-Ping Li, LI ER PING, Li Er-Ping Electrical Modeling and Design for 3d System Integration Inglese 19.04.2012 Copertina rigida Fr. 180.00 1-3 settimane (non disponibile a breve termine)
S W Rick Lee, S W Ricky Lee, S. W. Ricky Lee, S. W. Ricky Lo Lee, Swr Lee, Jeffery C Lo... - From Led to Solid State Lighting
S W Rick Lee, S W Ricky Lee, S. W. Ricky Lee, S. W. Ricky Lo Lee, Swr Lee, Jeffery C Lo... From Led to Solid State Lighting Inglese 31.12.2018 Copertina rigida Fr. 180.00 1-3 settimane (non disponibile a breve termine)
Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata, Toshiyuki Tsuchiya... - Reliability of MEMS
Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata, Toshiyuki Tsuchiya... Reliability of MEMS Inglese 01.04.2013 Tascabile Fr. 91.00 3-5 settimane
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... - CMOS-MEMS
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata... CMOS-MEMS Inglese 01.04.2013 Tascabile Fr. 91.00 3-5 settimane
Jasbir Bath, Jasbir (EDT)/ Henshall Bath, Jasbir Handwerker Bath, Carol A. Handwerker, G Henshall, Greg Henshall... - Lead-Free Solder Process Development
Jasbir Bath, Jasbir (EDT)/ Henshall Bath, Jasbir Handwerker Bath, Carol A. Handwerker, G Henshall, Greg Henshall... Lead-Free Solder Process Development Inglese 01.03.2011 Copertina rigida Fr. 176.00 1-3 settimane (non disponibile a breve termine)
Liu, J Liu, J. Liu, S Liu, S. Liu, Shen (Huazhong University of Science and Tech Liu... - Modeling and Simulation for Microelectronic Packaging Assembly
Liu, J Liu, J. Liu, S Liu, S. Liu, Shen (Huazhong University of Science and Tech Liu... Modeling and Simulation for Microelectronic Packaging Assembly Inglese 21.10.2011 Copertina rigida Fr. 180.00 1-3 settimane (non disponibile a breve termine)
Rainer Waser, Raine Waser, Rainer Waser - Nanoelectronics and Information Technology
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S Kyeong, San Kyeong, San (University of Maryland Kyeong, San Pecht Kyeong, Michael G. Pecht, Seoul Na... - Electrical Connectors
S Kyeong, San Kyeong, San (University of Maryland Kyeong, San Pecht Kyeong, Michael G. Pecht, Seoul Na... Electrical Connectors Inglese 31.10.2020 Copertina rigida Fr. 190.00 1-3 settimane (non disponibile a breve termine)
Jaroszewski, M Jaroszewski, Macie Jaroszewski, Maciej Jaroszewski, Maciej Thomas Jaroszewski, Ajay V Rane... - Advanced Materials for Electromagnetic Shielding
Jaroszewski, M Jaroszewski, Macie Jaroszewski, Maciej Jaroszewski, Maciej Thomas Jaroszewski, Ajay V Rane... Advanced Materials for Electromagnetic Shielding Inglese 01.01.2019 Copertina rigida Fr. 296.00 1-3 settimane (non disponibile a breve termine)
Shen Liu, Sheng Liu, Liu Shen, Xiaobing Luo, Xiaobing et al Luo, K Wang... - Freeform Optics for Led Packages and Applications
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Flora Li, Flora M Li, Flora M. Li, Aroki Nathan, Arokia Nathan, Beng S. Ong... - Organic Thin Film Transistor Integration
Flora Li, Flora M Li, Flora M. Li, Aroki Nathan, Arokia Nathan, Beng S. Ong... Organic Thin Film Transistor Integration Inglese, Tedesco 12.04.2011 Copertina rigida Fr. 134.00 3-5 settimane
Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang - Sip System-In-Package Design and Simulation
Suny Li (Li Yang), S Li, Suny Li, Suny Li (Li Yang), Liu Yang Sip System-In-Package Design and Simulation Inglese 11.09.2017 Copertina rigida Fr. 200.00 1-3 settimane (non disponibile a breve termine)
Jasbir Bath, Handwerker, Carol Handwerker, Carol A Handwerker, Carol A. Handwerker, Kato... - Mitigating Tin Whisker Risks
Jasbir Bath, Handwerker, Carol Handwerker, Carol A Handwerker, Carol A. Handwerker, Kato... Mitigating Tin Whisker Risks Inglese 01.07.2016 Copertina rigida Fr. 186.00 1-3 settimane (non disponibile a breve termine)