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Embedded Fan Out Wafer Panel Level Packaging Technologies for
English
04.01.2022
Hardback
Fr. 196.00
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
English
31.01.2019
Hardback
Fr. 190.00
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
English
01.07.2009
Hardback
Fr. 189.00
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
English
01.01.2014
Paperback / Softback
Fr. 189.00