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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
List of contents
TECHNOLOGIES
A. Adhesive and Anodic Bonding
Glass Frit Wafer Bonding
Wafer Bonding Using Spin-On Glass as Bonding Material
Polymer Adhesive Wafer Bonding
Anodic Bonding
B. Direct Wafer Bonding
Direct Wafer Bonding
Plasma-Activated Bonding
C. Metal Bonding
Au/Sn Solder
Eutectic Au-In Bonding
Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers
Wafer-Level Solid-Liquid Interdiffusion Bonding
D. Hybrid Metal/Dielectric Bonding
Hybrid Metal/Polymer Wafer Bonding Platform
Cu/SiO2 Hybrid Bonding
Metal/Silicon Oxide Hybrid Bonding
APPLICATIONS
Microelectromechanical Systems
Three-Dimensional Integration
Temporary Bonding for Enabling Three-Dimensional Integration and Packaging
Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems
Thin Wafer Support System for above 250°C Processing and Cold De-bonding
Temporary Bonding: Electrostatic
About the author
Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Molecular Solid-State Technologies (EMFT) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
Summary
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
