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Ali Shakouri, Je-hyeong Bahk, Je-hyeong (Univ Of Cincinnati Bahk, Je-Hyeong Bahk, Kazuaki Yazawa, Je-Hyeong Bahk & Ali Sha Kazuaki Yazawa... - Thermoelectric Energy Conversion Devices And Systems

Ali Shakouri, Je-hyeong Bahk, Je-hyeong (Univ Of Cincinnati Bahk, Je-Hyeong Bahk, Kazuaki Yazawa, Je-Hyeong Bahk & Ali Sha Kazuaki Yazawa... Thermoelectric Energy Conversion Devices And Systems English 31.03.2021 Hardback Fr. 195.00 1-3 weeks (not available at short notice)

Karl J L Geisler & B Madhusudan Iyengar, Karl J L Geisler, Karl J. L. Geisler, Madhusudan Iyengar, Bahgat Sammakia, Bahgat G Sammakia... - COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT

Karl J L Geisler & B Madhusudan Iyengar, Karl J L Geisler, Karl J. L. Geisler, Madhusudan Iyengar, Bahgat Sammakia, Bahgat G Sammakia... COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT English, Fula 27.08.2014 Hardback Fr. 240.00 2-3 weeks (title will be printed to order)

Sandborn Peter, Peter Sandborn, Peter Sandborn - COST ANAL ELECTRON SYS (2ND ED)

Sandborn Peter, Peter Sandborn, Peter Sandborn COST ANAL ELECTRON SYS (2ND ED) English 15.12.2016 Hardback Fr. 279.70 2-3 weeks (title will be printed to order)

Ki Jin Han, Swaminathan Madhavan, Madhavan Swaminathan & Ki Jin Han, Madhavan Swaminathan - Design and Modeling for 3D ICs and Interposers

Ki Jin Han, Swaminathan Madhavan, Madhavan Swaminathan & Ki Jin Han, Madhavan Swaminathan Design and Modeling for 3D ICs and Interposers English 05.11.2013 Hardback Fr. 234.00 2-3 weeks (title will be printed to order)

Lee Yung-cheng, Yu-Ting Cheng & Ramesh Ramadoss Y C Lee, Yu-Ting Cheng, Y C Lee, Y. C. Lee, Yung-Cheng Lee... - MEMS Packaging

Lee Yung-cheng, Yu-Ting Cheng & Ramesh Ramadoss Y C Lee, Yu-Ting Cheng, Y C Lee, Y. C. Lee, Yung-Cheng Lee... MEMS Packaging English 31.12.2019 Hardback Fr. 211.20 2-3 weeks (title will be printed to order)

Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter - Cost Analysis of Electronic Systems

Sandborn Peter, Peter Sandborn, Peter Sandborn, Sandborn Peter Cost Analysis of Electronic Systems English 07.11.2012 Hardback Fr. 223.20 2-3 weeks (title will be printed to order)

Christopher Bailey, Hua Lu, Stoyan Stoyanov - Co-Design and Modelling for Advanced Integration and Packaging: Manufacturing and Reliability

Christopher Bailey, Hua Lu, Stoyan Stoyanov Co-Design and Modelling for Advanced Integration and Packaging: Manufacturing and Reliability English Hardback Fr. 190.90 Will be released 01.06.2026