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To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
List of contents
Foreword on Professor Avram Bar-Cohen's Contribution to the Electronics Packaging Field; A Review of Cooling Road Maps for 3D Chip Packages; Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; Energy Reduction and Performance Maximization Through Improved Cooling; Optimal Choice of Heat Sinks From an Industrial Point of View with a Focus on LED Applications; Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems; Recent Advance in Thermoelectric Devices for Electronics Cooling; Energy Efficient Solid-State Cooling for Hot Spot Removal; An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges; Estimation of Cooling Performance of Phase Change Material (PCM) Module; Optimization Under Uncertainty for Electronics Cooling Design; Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling; A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes; Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management; Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics.
