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Milind Bhagavat, Imi Cao, Imin Cao, Imin Bhagavat Cao, Chunhui Chung, I Kao... - Wafer Manufacturing

Milind Bhagavat, Imi Cao, Imin Cao, Imin Bhagavat Cao, Chunhui Chung, I Kao... Wafer Manufacturing English 29.01.2021 Hardback Fr. 170.00 1-3 weeks (not available at short notice)

James J. -. Lu, James Jian-Qiang Lu, Peter Ramm, Maaike M. V. Taklo, Jame Jian-Qiang Lu, James Jian-Qiang Lu... - Handbook of Wafer Bonding

James J. -. Lu, James Jian-Qiang Lu, Peter Ramm, Maaike M. V. Taklo, Jame Jian-Qiang Lu, James Jian-Qiang Lu... Handbook of Wafer Bonding English 01.01.2012 Hardback Fr. 188.00 3-5 weeks

Beth Krohnert Keser, Beth Keser, Kröhnert, Steffen Kröhnert - Embedded Fan Out Wafer Panel Level Packaging Technologies for

Beth Krohnert Keser, Beth Keser, Kröhnert, Steffen Kröhnert Embedded Fan Out Wafer Panel Level Packaging Technologies for English 04.01.2022 Hardback Fr. 196.00 1-3 weeks (not available at short notice)

Keser, B Keser, Bet Keser, Beth Keser, Beth Kroehnert Keser, Beth Krohnert Keser... - Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Keser, B Keser, Bet Keser, Beth Keser, Beth Kroehnert Keser, Beth Krohnert Keser... Advances in Embedded and Fan-Out Wafer Level Packaging Technologies English 31.01.2019 Hardback Fr. 190.00 1-3 weeks (not available at short notice)