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Kapur, Kailash Kapur, Kailash C Kapur, Kailash C. Kapur, Kailash C. (University of Washington Kapur, Kailash C. Pecht Kapur... - Reliability Engineering
Kapur, Kailash Kapur, Kailash C Kapur, Kailash C. Kapur, Kailash C. (University of Washington Kapur, Kailash C. Pecht Kapur... Reliability Engineering English 30.05.2014 Hardback Fr. 212.40 1-3 weeks (not available at short notice)
Bartels, B Bartels, Bjoer Bartels, Bjoern Bartels, Bjoern Ermel Bartels, Bjoern/ Ermel Bartels... - Strategies to the Prediction, Mitigation and Management of Product
Bartels, B Bartels, Bjoer Bartels, Bjoern Bartels, Bjoern Ermel Bartels, Bjoern/ Ermel Bartels... Strategies to the Prediction, Mitigation and Management of Product English 08.06.2012 Hardback Fr. 186.00 3-5 weeks
Pecht, MG Pecht, Michael Pecht, Michael (University of Wisconsin-Madison Pecht, Michael G. (University of Wisconsin-Madison Pecht, Pecht Michael... - Parts Selection and Management
Pecht, MG Pecht, Michael Pecht, Michael (University of Wisconsin-Madison Pecht, Michael G. (University of Wisconsin-Madison Pecht, Pecht Michael... Parts Selection and Management English 25.02.2004 Hardback Fr. 241.20 1-3 weeks (not available at short notice)
W Liu, Weifeng Liu, Weifeng (Hewlett Packard) Pecht Liu, Weifeng Pecht Liu, Michael Pecht, Michael G Pecht... - Ic Component Sockets
W Liu, Weifeng Liu, Weifeng (Hewlett Packard) Pecht Liu, Weifeng Pecht Liu, Michael Pecht, Michael G Pecht... Ic Component Sockets English 16.04.2004 Hardback Fr. 189.60 1-3 weeks (not available at short notice)
Haleh Ardebili, Michael Pecht, Michael G Pecht, Michael G. Pecht - Encapsulation Technologies for Electronic Applications
Haleh Ardebili, Michael Pecht, Michael G Pecht, Michael G. Pecht Encapsulation Technologies for Electronic Applications English 01.06.2009 Hardback Fr. 256.00 1-3 weeks (not available at short notice)
Edward B Hakim, Edward B. Hakim, Pradeep Lall, Pradeep Pecht Lall, Michael Pecht, Michael G Pecht... - Influence of Temperature on Microelectronics and System Reliability
Edward B Hakim, Edward B. Hakim, Pradeep Lall, Pradeep Pecht Lall, Michael Pecht, Michael G Pecht... Influence of Temperature on Microelectronics and System Reliability English 19.06.2019 Paperback / Softback Fr. 82.00 1-3 weeks (not available at short notice)
Pecht, MG Pecht, Michael Pecht, Michael (University of Maryland Pecht, Michael G Pecht, Michael G. Pecht... - Soldering Processes and Equipment
Pecht, MG Pecht, Michael Pecht, Michael (University of Maryland Pecht, Michael G Pecht, Michael G. Pecht... Soldering Processes and Equipment English 06.07.1993 Hardback Fr. 234.00 1-3 weeks (not available at short notice)
Pecht, Michael Pecht, Michael G Pecht, Michael G. Pecht - Integrated Circuit, Hybrid and Multichip Module Package Design
Pecht, Michael Pecht, Michael G Pecht, Michael G. Pecht Integrated Circuit, Hybrid and Multichip Module Package Design English 16.03.1994 Hardback Fr. 292.80 3-5 weeks (title will be specially ordered)
Dasgupta, Evans, Pecht, Michael Pecht, Michael G. Pecht, Abhijit Dasgupta... - Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Dasgupta, Evans, Pecht, Michael Pecht, Michael G. Pecht, Abhijit Dasgupta... Quality Conformance and Qualification of Microelectronic Packages and Interconnects English 13.12.1994 Paperback / Softback Fr. 259.20 3-5 weeks (title will be specially ordered)
Preeti Chauhan, Preeti S Chauhan, Preeti S. Chauhan, Anupa Choubey, Anupam Choubey, Michael Pecht... - Copper Wire Bonding
Preeti Chauhan, Preeti S Chauhan, Preeti S. Chauhan, Anupa Choubey, Anupam Choubey, Michael Pecht... Copper Wire Bonding English 22.08.2012 Hardback Fr. 158.00 6-7 weeks