Implementing Lead-Free Electronics

By June 2006 any company selling electronics into the European Union and China will have to convert to lead-free manufacturing processesVirtually every electronics manufacturer in the world is faced with an expensive revamp of their operations. This book shows them how to choose the right Lead-Free processes and make the conversion as efficiently and inexpensively as possible.

List of contents

Chapter 1: Introduction

Chapter 2: Manufacturing Implementation Approaches

Chapter 3: Selecting Lead-Free Alloys for Solder Interconnections

Chapter 4: Applying Solder Paste

Chapter 5: Selecting Component Coating and PCB Surface Finish

Chapter 6: Applying Mass Reflow Soldering

Chapter 7: Wave Soldering and Selective Soldering

Chapter 8: Compatibility and Cost Considerations

Chapter 9: Other Manufacturing and Common Production Defect Considerations

Chapter 10: Reliability and Accelerated Temperature Cycling Tests

About the author

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Summary

By June 2006 any company selling electronics into the European Union and China will have to convert to lead-free manufacturing processes. This book shows electronics manufacturers how to choose the right Lead-Free processes and make the conversion as efficiently and inexpensively as possible.

Product details

• Authors: Jennie Hwang, Jennie S. Hwang
• Publisher: McGraw-Hill
• Languages: English
• Product format: Hardback
• Released: 16.01.2005
• EAN: 9780071443746
• ISBN: 978-0-07-144374-6
• Dimensions: 158 mm x 231 mm x 42 mm
• Weight: 848 g
• Illustrations: Illustrationen, nicht spezifiziert
• Series: McGraw-Hill Professional Engin; Professional Engineering; McGraw-Hill Professional Engin
• Subjects: Natural sciences, medicine, IT, technology > Technology > Mechanical engineering, production engineering; TECHNOLOGY & ENGINEERING / Electronics / General, Electronics engineering