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SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE
Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.
Failure-Free Integrated Circuit Packages helps you:
Find, identify, and correct potential failures before they occur
Improve device reliability
Learn from case studies of IC package failure modes
Quickly locate failures through visual comparisons
Apply state-of-the-art failure analysis techniques
Comprehend the physics behind the failure mechanism
Understand the limitations of reliability testing and lifetime estimation
INSIDE, YOU'LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE:
Fundamentals of IC package technologies
Reliability
Physics and chemistry of failures in packaged devices
Strategies for locating failures
Failure analysis techniques
Failure modes common in organic IC packages
Emerging assembly materials for IC packaging
List of contents
Chapter 1 Introduction Chapter 2 Fundamentals of IC Package Technologies Chapter 3 Device Reliability Chapter 4 Physics and Chemistry of Failures in Packaged Devices Chapter 5 Strategies for Locating Failures Chapter 6 Failure Analysis Techniques Chapter 7 Examples of Failure Modes Common in Organic IC Packages Chapter 8 Emerging Assembly Materials for IC Packaging Index
About the author
Charles A. Harper is the President of Technology Seminars, Inc., an organization that provides educational training courses for industry professionals. He is a member of the IEEE and the Society of Plastics Engineers, and has taught many courses on plastics, including as an adjunct professor at Johns Hopkins University.
Summary
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
