Fr. 414.00

Radiation Curing in Polymer Science and Technology - Fundamentals and methods

English · Hardback

Shipping usually within 2 to 3 weeks (title will be printed to order)

Description

Read more

Volume one deals primarily with the basic principles of radiation curing: UV-curing; EB-curing; microwave curing; oligomer/resin technology; chemistry of imaging science; testing methods; equipment; coatings applications and emerging trends in photopolymers for holographic recording and laser induced reactions.

List of contents

State of the art and trends in the radcure market - P Dufour; An introduction to basic principles in UV-curing - J P Fouassier; Polymers in x-ray electron beam and ion beam - L Schlegel and W Schnabel; Applications of electron beam curing - J Seidel; UV and electron beam curable prepolymers and diluent monomers: classification, preparation and properties - N S Allen; Role of grafting in UV- and -EB curing reactions - P A Dworjanyn and J L Garnett; Experimental and analytical methods for the investigation of radiation curing - J F Rabek; UV-radiation sources and radiation devices for industrial production processes - J F Rabek; Electron beam processing machinery - S V Nablo; Index.

Report

See the Four Volume Set

Product details

Assisted by F Rabek (Editor), F Rabek (Editor), J.P. Fouassier (Editor), Jean-Pierr Fouassier (Editor), Jean-Pierre Fouassier (Editor), J. F. Rabek (Editor), J.F. Rabek (Editor), Jan F. Rabek (Editor)
Publisher Springer Netherlands
 
Languages English
Product format Hardback
Released 29.06.2009
 
EAN 9781851669295
ISBN 978-1-85166-929-5
No. of pages 563
Weight 975 g
Illustrations VIII, 563 p.
Subject Natural sciences, medicine, IT, technology > Technology > Chemical engineering

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.