Fr. 340.00

Interfacial Electroviscoelasticity and Electrophoresis - Theory and Applications

English · Hardback

Shipping usually within 1 to 3 weeks (not available at short notice)

Description

Read more

Informationen zum Autor Jyh-Ping Hsu, Aleksandar M. Spasic Klappentext Not only is this the first text devoted to electroviscoelasticity! but it also describes a new theory developed through the authorsa (TM) research. This theory is likely to impact other research and applications as the modeling of liquid-liquid interfaces is key to numerous chemical manufacturing processes including those for emulsions! suspensions! nanopowders! foams! biocoloids! and plasmas. As the authors cover phenomena at the micro! nano! and atto-scales! their techniques as well as their data will be of particular interest to nanoscientists. The authors provide substantial data to support their theory and consider its implications especially with regard to the breaking of emulsions. Zusammenfassung Focuses on electroviscoelasticity, and describes a theory that may impact other research and applications as the modeling of liquid-liquid interfaces is key to numerous chemical manufacturing processes including those for emulsions, suspensions, nanopowders, foams, biocoloids, and plasmas. Inhaltsverzeichnis Introduction. Classification of Finely Dispersed Systems. General. Historical Review and Motivation. Particular. Theory of Electroviscoelasticity. Appendix. Experimental. Experimental. Conclusions. Implications. Electrophoresis. Introduction. General Governing Equations. Boundary Conditions. Perturbation Approach. Boundary Effects. Solution Procedure. Concluding Remarks. List of Symbols. References. Author Index. Subject Index.

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.