Advances in Cryogenic Engineering - Parts A & B

The Hyatt Regency Hotel, Columbus, Ohio was the venue for the 1995 Cryogenic Engineering Conference. The meeting was held jointly with the International Cryogenic Materials Conference. Jim Peeples, of CVI, Inc., was conference chairman. Columbus is the home of the Battelle Memorial Institute, a pioneer in cryogenic materials development; the home of CVI, Inc., and Lake Shore Cryotronics, Inc., two leading manufacturers of cryogenic equipment; and it is the home of Ohio State University, where research on liquid helium has long been conducted. The program consisted of 315 CEC papers, nearly the same number as for CEC-91. This was the second largest number of papers ever submitted to the CEC. Of these, 252 papers are published here, in Volume 41 of Advances in Cryogenic Engineering. Once again the volume is published in two books. This volume includes a number of photographs taken during the awards lunch on July 20, 1995. Photographs have often been taken during the conferences, but they have never been used. The pictures are of the awardees, the conference chairs, and the organizers. They are distributed through out the books on pages that would otherwise have been blank. The pictures can be found on the following pages: 28, 232, 334, 536, 640, 826, 990, 1032, 1202, 1462,1682,1888, and 1994.

List of contents

A.- B.- Indices.- Author Index.

Summary

Proceedings of the 1995 conference held in Columbus, Ohio, July, 17-21, 1995.

Product details

• Assisted by: Peter Kittel (Editor)
• Publisher: Springer, Berlin
• Languages: English
• Product format: Hardback
• Released: 06.12.2012
• EAN: 9780306453007
• ISBN: 978-0-306-45300-7
• No. of pages: 1014
• Dimensions: 180 mm x 258 mm x 53 mm
• Weight: 3940 g
• Illustrations: XLVIII, 1014 p. 333 illus.
• Series: Advances in Cryogenic Engineering; Advances in Cryogenic Engineer; Advances in Cryogenic Engineering (Closed); Advances in Cryogenic Engineer; Advances in Cryogenic Engineering
• Subject: Natural sciences, medicine, IT, technology > Physics, astronomy > Mechanics, acoustics