Three-Dimensional Integration and Modeling

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Product details

• Authors: John Hoon Lee, Jong Hoon Lee, Manos M. Tentzeris
• Publisher: Morgan & Claypool Publishers
• Languages: English
• Product format: Paperback / Softback
• Released: 01.01.2007
• No. of pages: 108
• Dimensions: 192 mm x 236 mm x 10 mm
• Weight: 234 g
• Series: Synthesis Lectures on Computat
• Subject: Natural sciences, medicine, IT, technology > Technology > Heat, energy and power station engineering