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Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps.
List of contents
DESIGN Design Environment and Design Flow; Modelling and Validation; Micro Powder Injection Process Modelling
TOOLING Mould Insert Manufacturing Strategies; Micro End-milling in Hardened Steel; Laser Ablation 3D-Microstructuring, Micro EDM, Lithographic Fabrication, Material States, and Surface Conditioning of Mold Inserts
REPLICATION TECHNIQUES Micro Injection Molding - Principles and Challenges; Micro Metal Injection Molding; Micro Ceramic Injection Molding; Micro Casting; Micro Electroforming of Metals; Micro EPD, Tape Embossing, and Slip Casting of Ceramics
AUTOMATION AND QUALITY ASSURANCE Powder Injection Moulding Process Automation; Assembly; Quality Assurance and Dimensional Measurement Technology
PROPERTIES OF MATERIALS AND MICROCOMPONENTS Structures and Properties of Metallic Materials; Structures and Properties of Ceramic Materials; Tribological Characterization of Mould Inserts and Materials for Micro Components; Simulation Tool Development for Wear in Microsystems
About the author
Oliver Brand is Professor of Bioengineering and Microelectronics/Microsystems at Georgia Institute of Technology, Atlanta, USA. He received his diploma degree in Physics from Technical University Karlsruhe, Germany, in 1990, and his PhD from ETH Zurich, Switzerland, in 1994. Between 1995 and 2002, he held research and teaching positions at the Georgia Institute of Technology (1995-1997) and ETH Zurich (1997-2002). Oliver Brand's research interest is in the areas of CMOS-based micro- and nanosystems, MEMS fabrication technologies, and microsystem packaging.
