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Informationen zum Autor Dr. Chris A. Mack developed the lithography simulation software PROLITH, and founded and ran the company FINLE Technologies fro ten years. He then served as Vice President of Lithography Technology for KLA-Tencor for five years, until 2005. In 2003 he received the SEMI Award for North America for his efforts in lithography simulation and education. He is also an adjunct faculty member at the University of Texas at Austin. Currently, he writes, teaches, and consults on the field of semiconductor microlithography in Austin, Texas. Klappentext The fabrication of an integrated circuit requires a variety of physical and chemical processes to be performed on a semiconductor substrate. In general, these processes fall into three categories: film deposition, patterning, and semiconductor doping. Films of both conductors and insulators are used to connect and isolate transistors and their components.By creating structures of these various components millions of transistors can be built and wired together to form the complex circuitry of modern microelectronic devices. Fundamental to all of these processes is lithography, ie, the formation of three-dimensional relief images on the substrate for subsequent transfer of the pattern to the substrate.This book presents a complete theoretical and practical treatment of the topic of lithography for both students and researchers. It comprises ten detailed chapters plus three appendices with problems provided at the end of each chapter. Zusammenfassung Fundamental Principles of Optical Lithography: The Science of Microfabrication presents a complete theoretical and practical treatment of the topic of lithography for both students and researchers. This sole-authored text includes optional computer simulation exercises as well as problems at the end of each chapter. Inhaltsverzeichnis Preface xv 1. Introduction to Semiconductor Lithography 1 1.1 Basics of IC Fabrication 2 1.1.1 Patterning 2 1.1.2 Etching 3 1.1.3 Ion Implantation 5 1.1.4 Process Integration 6 1.2 Moore's Law and the Semiconductor Industry 7 1.3 Lithography Processing 12 1.3.1 Substrate Preparation 14 1.3.2 Photoresist Coating 15 1.3.3 Post-Apply Bake 18 1.3.4 Alignment and Exposure 19 1.3.5 Post-exposure Bake 23 1.3.6 Development 24 1.3.7 Postbake 25 1.3.8 Measure and Inspect 25 1.3.9 Pattern Transfer 25 1.3.10 Strip 26 Problems 26 2. Aerial Image Formation - The Basics 29 2.1 Mathematical Description of Light 29 2.1.1 Maxwell's Equations and the Wave Equation 30 2.1.2 General Harmonic Fields and the Plane Wave in a Nonabsorbing Medium 32 2.1.3 Phasors and Wave Propagation in an Absorbing Medium 33 2.1.4 Intensity and the Poynting Vector 36 2.1.5 Intensity and Absorbed Electromagnetic Energy 37 2.2 Basic Imaging Theory 38 2.2.1 Diffraction 39 2.2.2 Fourier Transform Pairs 43 2.2.3 Imaging Lens 45 2.2.4 Forming an Image 47 2.2.5 Imaging Example: Dense Array of Lines and Spaces 48 2.2.6 Imaging Example: Isolated Space 50 2.2.7 The Point Spread Function 51 2.2.8 Reduction Imaging 53 2.3 Partial Coherence 56 2.3.1 Oblique Illumination 57 2.3.2 Partially Coherent Illumination 58 2.3.3 Hopkins Approach to Partial Coherence 62 2.3.4 Sum of Coherent Sources Approach 63 2.3.5 Off-Axis Illumination 65 2.3.6 Imaging Example: Dense Array of Lines and Spaces Under Annular Illumination 66 2.3.7 Köhler Illumination 66 2.3.8 Incoherent Illumination 69 2.4 Some Imaging Examples 70 Problems 71 3. Aerial Image Formation - The Details 75 3.1 Aberrations 75 3.1.1 The Causes of Aberrations 75 3.1.2 Describing Ab...
