Ceramic Interconnect Technology Handbook

Informationen zum Autor III Barlow, Aicha Elshabini Klappentext With their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications. Zusammenfassung Offers coverage of various aspects of ceramic interconnect technologies in electronics and electronic packaging. This book discusses trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications. Inhaltsverzeichnis Overview of Ceramic Interconnect Technology. Electrical Design, Simulation, and Testing. ThermoMechanical Design. Ceramic Materials. Screen Printing. Multilayer Ceramics. Photo-Defined and Photo-Imaged Films. Copper Interconnects for Ceramic Substrates and Packages. Integrated Passives in Ceramic Substrates. Index.

Product details

• Authors: Fred D. Barlow, III Barlow, BARLOW FRED D III ELSHABINI AI
• Assisted by: Fred D. Barlow (Editor), III Barlow (Editor), Fred D. Barlow III (Editor), Aicha Elshabini (Editor), Aicha (University of Arkansas Elshabini (Editor), Elshabini Aicha (Editor)
• Publisher: Taylor & Francis Ltd.
• Languages: English
• Product format: Hardback
• Released: 24.01.2007
• EAN: 9780849335570
• ISBN: 978-0-8493-3557-0
• No. of pages: 456
• Subjects: Natural sciences, medicine, IT, technology > Physics, astronomy > Atomic physics, nuclear physics; TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Electronics / Microelectronics, Electrical Engineering, Materials science, Electronics engineering, Mathematics & science, Mathematics and science, TECHNOLOGY & ENGINEERING / Materials Science / General, Ceramics & glass technology, Ceramic and glass technology