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This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects.
For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.
List of contents
Preface. 1: Invited Lectures; C.J.M. Lasance, A. Bar-Cohen, S. Witzman. 2: Numerical and Experimental Analysis of Systems; S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield, J.D. Parry, D.G. Tatchell, H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman, W. Nelemans, E. Lauwers, J.L. Blanchard, J.M. Morelle, M. Misale. 3: Numerical and Experimental Analysis of Channels; C. di Perna, A. Evangelisti, M. Paroncini, R. Ricci, J.B. Saulnier, H.Y. Wang, B. Fourka, O. Manca, S. Nardini, V. Naso. 4: Numerical and Experimental Analysis of Electronic Parts; N. Ottavy, M. Bourhrara, J.-P. Le Jannou, P. Paris, G. Wachutka, J. Funk, H. Baltes, S. Mergui, F. Penot, J. Punch, M. Davies, J. Aklhoja, D. Rauly, F. Grandjean, K. Nederveen. 5: Measurement Techniques; R.P. Tye, R.L. Gardner, H.J.L. Vanlaer, C.J.M. Lasance, P. Rodgers, M. Davies. 6: Liquid Cooling of Electronic Devices; B. Gromoll, K. Köberle, H. Auracher, G. Guglielmini, M. Misale, C. Schenone. 7: Thermal Characterization of Electronic Parts; T. Fromont, B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne, E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens, M. Davies, J. Lohan, J. Punch, T. Moore, D. Liu, J. Barrett, S.C.Ó. Mathúna. 8: Thermal Stress and Die Attach Defects; S. Witzman, D.E. Mix, A. Bar-Cohen, F. Michard, J.M. Dupont, H. Ribot, M. Salagoity. Author Index.
Summary
This volume presents an overview of recent developments in the thermal management of electronic systems. The topics covered include thermal management in general, thermally induced failure, channels and electronic components, measurement techniques, liquid cooling and thermal characterization.
