Printed Electronics for Smart Packaging

This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging.

List of contents

Chapter 1 Introduction of Printed Electronics and Smart Packaging
Chapter 2 Mechanisms and Strategies of Smart Packaging
Chapter 3 Printing Methods and Integrated Strategies
Chapter 4 Functional Inks and Substrates for Smart Packaging
Chapter 5 Printed Tracks for Smart Tags and Packaging
Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
Chapter 7 Printed Sensors and Indicators
Chapter 8 Integrated Printed Electronics Systems
Chapter 9 Outlooks and Perspectives

About the author

Wei Wu is full professor of School of Physics and Technology, Wuhan University. He received the State Scientific Innovation and Pioneer Award in 2023, the 15th Bi Sheng Award of Printing Technology in 2019, the STAM Best Paper Award in 2017, and the Hong Kong Scholars Award in 2014.

Product details

• Authors: Wei Wu
• Publisher: Wiley-VCH
• Languages: English
• Product format: Hardback
• Release: 24.12.2025
• EAN: 9783527351169
• ISBN: 978-3-527-35116-9
• No. of pages: 320
• Dimensions: 176 mm x 20 mm x 252 mm
• Weight: 751 g
• Illustrations: 1 Tabellen
• Subjects: Natural sciences, medicine, IT, technology > Chemistry; Physik, Elektronikbauteile, Elektronische Geräte und Materialien, Physics, Materialwissenschaften, Materials science, Electronic materials, Electrical & Electronics Engineering, Elektrotechnik u. Elektronik, Elektronische Materialien, Halbleiterphysik, Semiconductor Physics, Electronic Packaging