Introduction to Microelectronics Advanced Packaging Assurance

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

List of contents

Introduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.

Product details

• Authors: Navid Asadizanjani, Dali, Hamed Dalir, Him Reddy Kottur, Himanandhan Reddy Kottur, Himanandhan Reddy Kottur_
• Publisher: Springer, Berlin
• Languages: English
• Product format: Hardback
• Released: 14.04.2025
• EAN: 9783031861017
• ISBN: 978-3-0-3186101-7
• No. of pages: 183
• Dimensions: 168 mm x 14 mm x 240 mm
• Weight: 464 g
• Illustrations: XIX, 183 p. 45 illus., 43 illus. in color.
• Series: Synthesis Lectures on Engineering, Science, and Technology
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; Elektronik, Eingebettete Systeme, Embedded Systems, Electronics and Microelectronics, Instrumentation, Electronics Design and Verification, Emerging trends in advanced packaging, Advanced packaging manufacturing, Testing and reliability, Semiconductor assurance, Advanced microelectronics packaging Ecosystem