Recent Trends in Vlsi and Semiconductor Packaging

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

Product details

• Authors: T. Vasudeva Rao Reddy
• Assisted by: K. Madhava Rao (Editor), K.Madhava Rao (Editor), T. Vasudeva Reddy (Editor)
• Publisher: Taylor & Francis Ltd.
• Languages: English
• Product format: Hardback
• Released: 06.05.2025
• EAN: 9781041017868
• ISBN: 978-1-0-4101786-8
• No. of pages: 616
• Subjects: Natural sciences, medicine, IT, technology > IT, data processing > Programming languages; COMPUTERS / Computer Science, COMPUTERS / Programming / Algorithms, computer science, Electrical Engineering, Mechanical Engineering, Internet of things;Semiconductor;Machine learning