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Informationen zum Autor J Reece Roth Klappentext Written by a leading expert in the field, the paperback edition of Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices that are of commercial interest. The text is suitable for students or in-service users with a physics and calculus background at the sophomore level. These two volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines and as a reference source by in-service engineers. Zusammenfassung Offers a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. This book also presents a description of plasma-related processes and devices that are of commercial interest. It is suitable for students with a physics and calculus background at the sophomore level. Inhaltsverzeichnis Surface Interactions in Plasma Processing. Atmospheric Pressure Plasma Sources. Vacuum Plasma Sources. Plasma Reactors for Plasma Processing. Specialized Techniques and Devices for Plasma Processing. Parametric Plasma Effects on Plasma Processing. Diagnostics for Plasma Processing. Plasma Treatment of Surfaces. Surface Modification by Implantation and Diffusion. Thin Film Deposition by Evaporative Condensation and Sputtering. Plasma Chemical Vapor Deposition (PCVD). Plasma Etching.
List of contents
Surface Interactions in Plasma Processing. Atmospheric Pressure Plasma Sources. Vacuum Plasma Sources. Plasma Reactors for Plasma Processing. Specialized Techniques and Devices for Plasma Processing. Parametric Plasma Effects on Plasma Processing. Diagnostics for Plasma Processing. Plasma Treatment of Surfaces. Surface Modification by Implantation and Diffusion. Thin Film Deposition by Evaporative Condensation and Sputtering. Plasma Chemical Vapor Deposition (PCVD). Plasma Etching.
