Fr. 270.30

Microengineering of Metals and Ceramics. Pt.2 - Special Replication Techniques, Automation, and Properties

English · Hardback

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Description

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Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Continuing from the previous volume, authors from three major competence centres for microengineering here cover all aspects of specialized replication techniques and how to employ state-of-the-art technologies for testing and characterizing micro-scale components, and illustrate quality control aspects and strategies for automation of production procedures in view of future industrial production and commercialisation.

List of contents

Replication Techniques: Micro Casting; Micro Electroforming of Metals; Micro EPD, Tape Embossing, and Slip Casting of CeramicsAutomation and Quality Assurance: Powder Injection Moulding Process Automation; Assembly; Quality Assurance and Dimensional Measurement Technology
Properties of Materials and Micro-Components: Structures and Properties of Metallic Materials; Structures and Properties of Ceramic Materials; Tribological Characterization of Mould Inserts and Materials for Micro Components; Simulation Tool Development for Wear in Microsystems

Product details

Assisted by Henry Baltes (Editor), Jürgen Haußelt (Editor), Detlef Löhe (Editor)
Publisher Wiley-VCH
 
Languages English
Product format Hardback
Released 01.01.2005
 
EAN 9783527314935
ISBN 978-3-527-31493-5
No. of pages 290
Dimensions 174 mm x 245 mm x 20 mm
Weight 718 g
Illustrations 156 SW-Abb., 37 Tabellen
Series Advanced Micro & Nanosystems
Advanced Micro and Nanosystems
Subject Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering

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