3d Integration in Vlsi Circuits - Implementation Technologies and Applications

Summary

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

Product details

• Authors: Katsuyuki (Ibm Thomas J. Watson Research C Sakuma
• Assisted by: Katsuyuki Sakuma (Editor)
• Publisher: Taylor & Francis Ltd.
• Languages: English
• Product format: Paperback / Softback
• Released: 30.06.2021
• EAN: 9781032095547
• ISBN: 978-1-0-3209554-7
• No. of pages: 234
• Series: Devices, Circuits, and Systems
• Subjects: Natural sciences, medicine, IT, technology > Technology > Electronics, electrical engineering, communications engineering; TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Electronics / Circuits / General, TECHNOLOGY & ENGINEERING / Electrical, COMPUTERS / Computer Engineering, Electronics: circuits and components, Circuits & components