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Zusatztext "[This book] is a complete primer that provides thorough and comprehensive knowledge to electronic manufacturers engaged in developing! manufacturing and utilizing lead free solder technologies in microelectronic assemblies. ? The book also addresses other important aspects such as health! environmental impact! legislation! global regulations! and market economics associated with this issue. ? Numerous illustrations! tables! and graphs are provided in each chapter to help readers grasp important concepts covered. ? Besides practicing engineers! advanced undergraduate students and graduate students in these disciplines may also find the book useful since it does not assume prior knowledge of the subject discussed and provides necessary background information." - E-Streams! Vol. 7! No. 11! Nov. 2004 "The book is laid out in a pleasant fashion with clear figures?Each chapter has an extensive list of references that would be extremely useful to researchers as well as microelectronic equipment manufacturers. The book is a comprehensive review of all aspects related to the development of lead-free solders! and the editors are commended for including global efforts along these lines?The editors succeeded in meeting their goals of making this book useful to folks concerned about electronic solders-scientists! researchers! managers! and marketing personnel! as well as students working toward advanced degrees?This is an excellent sequel [that] should be on the shelf of everyone working on microelectronics solders and packaging."-JOM! August 2005 "?is the best volume currently available with a good mixture of theory and practical lead-free information. It is strongly recommended as an addition to your bookshelf as there are lots of practical issues covered often overlooked by others. ?Reliability engineers will be happy with the amount of information and the number of good references for more research. Details are provided on the alloys! their performance! potential reliability and cost implications for the end user."-www.leadfreesoldering.com Informationen zum Autor Karl J. Puttlitz, Kathleen A. Stalter Klappentext Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies! as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. Zusammenfassung Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. Inhaltsverzeichnis Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations. ...
