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Handbook of Blockchain, Digital Finance, and Inclusion, Volume 2: ChinaTech, Mobile Security, and Distributed Ledger emphasizes technological developments that introduce the future of finance. Descriptions of recent innovations lay the foundations for explorations of feasible solutions for banks and startups to grow. The combination of studies on blockchain technologies and applications, regional financial inclusion movements, advances in Chinese finance, and security issues delivers a grand perspective on both changing industries and lifestyles. Written for students and practitioners, it helps lead the way to future possibilities.
List of contents
1. The Game of Dian Fu: The Rise of Chinese Finance
2. Balancing Innovation and Risks in Digital Financial Inclusion -Experiences of Ant Financial Services Group
3. Regulating FinTech in China: From Permissive to Balanced
4. Big Data Technology: Application and Cases
5. Trust Management in Mobile Platform
6. Security Issues of In-Store Mobile Payment
7. Blockchain - From Public to Private
8. Blockchain 101: An Introduction to the Future
9. Betting Blockchain Will Change Everything - SEC and CFTC Regulation of Blockchain Technology
10. Global Financial Institutions 2.0
11. Open-Source Operational Risk: Should Public Blockchains Serve as Financial Market Infrastructures?
12. Blockchain Architectures for Electronic Exchange Reporting Requirements: EMIR, Dodd Frank, MiFID I/II, MiFIR, REMIT, Reg NMS and T2S
13. Mobile Technology: The New Banking Model Connection Lending to the Social Network
14. Financial Inclusion, Digital Currency, and Mobile Technology
15. Digital Financial Inclusion in South East Asia
16. From the Ground Up: The Financial Inclusion Frontier
17. Indonesian Microfinance Institutions (MFI) Move to Technology - TBOP's Prodigy Experience
18. FinTech: Harnessing Innovation for Financial Inclusion
19. Inclusive Growth as Democratizing Productivity.
20. Autonomous Finance
21. Inclusion or Exclusion? Trends in Robo-advisory for Financial Investment Services
22. How 3D Printing Will Change the Future Borrowing Lending and Spending?
About the author
David LEE Kuo Chuen is a Professor of Financial Technology and Blockchain at the Singapore University of Social Sciences (SUSS), an Adjunct Professor at the National University of Singapore (NUS), a Council Member of the British Blockchain Association, Vice President of the Economic Society of Singapore, and Editor-in-Chief or Deputy Editor-in-Chief of the Journal of Fintech and Annual Review of Fintech. He is also Chairman of the Global FinTech Institute (GFI), co-founder of the Singapore Blockchain Association, co-founder of the Blockchain Security Alliance, advisor to the Asian Development Bank, cryptocurrency advisor to the Asian Institute of Digital Finance (AIDF) of NUS, advisor to the SUSS Node for inclusive FinTech (NiFT), independent director of several technology companies in Singapore, angel investor in blockchain, WEB3, inclusive finance and AI innovation, senior advisor and Investment Committee member of Artichoke Capital which is backed by institutional and sovereign wealth fund limited partners.
Robert Deng is AXA Chair Professor of Cybersecurity, Director of the Secure Mobile Centre, and Deputy Dean for Faculty & Research, School of Computing and Information Systems, Singapore Management University (SMU). He received the Outstanding University Researcher Award from National University of Singapore, Lee Kuan Yew Fellowship for Research Excellence from SMU, and Asia-Pacific Information Security Leadership Achievements Community Service Star from International Information Systems Security Certification Consortium. He serves/served on the editorial boards of ACM Transactions on Privacy and Security, IEEE Security & Privacy, IEEE Transactions on Dependable and Secure Computing, IEEE Transactions on Information Forensics and Security, Journal of Computer Science and Technology, and Steering Committee Chair of the ACM Asia Conference on Computer and Communications Security. He is a Fellow of IEEE and Fellow of Academy of Engineering Singapore.
