Fr. 146.00

Theory of Cryptography - 20th International Conference, TCC 2022, Chicago, IL, USA, November 7-10, 2022, Proceedings, Part I

English · Paperback / Softback

Shipping usually within 1 to 2 weeks (title will be printed to order)

Description

Read more

The three-volume set LNCS 13747, LNCS 13748 and LNCS 13749 constitutes the refereed proceedings of the 20th International Conference on Theory of Cryptography, TCC 2022, held in Chicago, IL, USA, in November 2022. The total of 60 full papers presented in this three-volume set was carefully reviewed and selected from 139 submissions. They cover topics on post-quantum cryptography; interactive proofs; quantum cryptography; secret-sharing and applications; succinct proofs; identity-based encryption and functional encryption; attribute-based encryption and functional encryption; encryption; multi-party computation; protocols: key agreement and commitments; theory: sampling and friends; lattices; anonymity, verfiability and robustness; ORAM, OT and PIR; and theory.

List of contents

Post-quantum cryptography.- Interactive proofs.- Quantum cryptography.- Secret-sharing and applications.- Succinct proofs.- Identity-based encryption and functional encryption.- Attribute-based encryption and functional encryption.

Product details

Assisted by Eike Kiltz (Editor), Vaikuntanathan (Editor), Vinod Vaikuntanathan (Editor)
Publisher Springer, Berlin
 
Languages English
Product format Paperback / Softback
Released 22.12.2022
 
EAN 9783031223174
ISBN 978-3-0-3122317-4
No. of pages 743
Dimensions 155 mm x 40 mm x 235 mm
Illustrations XIX, 743 p. 65 illus., 17 illus. in color.
Series Lecture Notes in Computer Science
Subject Natural sciences, medicine, IT, technology > IT, data processing > IT

Customer reviews

No reviews have been written for this item yet. Write the first review and be helpful to other users when they decide on a purchase.

Write a review

Thumbs up or thumbs down? Write your own review.

For messages to CeDe.ch please use the contact form.

The input fields marked * are obligatory

By submitting this form you agree to our data privacy statement.